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SN74ALS635J

Texas Instruments

SN74ALS635J by Texas Instruments

SN74ALS635J by Texas Instruments is a 48-terminal digital arithmetic circuit in ceramic rectangular package. Operating temperature range: 0-70°C, technology: TTL. Ideal for commercial applications requiring high-performance through-hole terminals with 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,722 parts In-Stock

1+ parts

-

100+ parts

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3,722

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Digiode

USA . 2,360 parts In-Stock

1+ parts

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2,360

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$4.965

100+ parts

-

1k+ parts

-

10k+ parts

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539

$4.965

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-

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Andel Nordic

Denmark . 3,469 parts In-Stock

1+ parts

$8.176

100+ parts

-

1k+ parts

$7.849

10k+ parts

$7.849

3,469

$8.176

-

$7.849

$7.849

One Stop Electronics

USA . 158 parts In-Stock

1+ parts

$27.000

100+ parts

-

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158

$27.000

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Parana Technologies

USA . 13 parts In-Stock

1+ parts

$29.310

100+ parts

-

1k+ parts

$57.930

10k+ parts

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13

$29.310

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$57.930

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DigiPath Technology Company

USA . 1,137 parts In-Stock

1+ parts

$32.274

100+ parts

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1,137

$32.274

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IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$32.933

100+ parts

$31.286

1k+ parts

$29.640

10k+ parts

-

1,366

$32.933

$31.286

$29.640

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ChromeModa Solutions

Germany . 830 parts In-Stock

1+ parts

$32.933

100+ parts

$27.005

1k+ parts

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830

$32.933

$27.005

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Corphita

USA . 1,625 parts In-Stock

1+ parts

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1,625

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Overview

Upgrade your digital arithmetic circuits with the SN74ALS635J by Texas Instruments, a top-quality product that delivers unmatched performance and reliability. Designed with precision in mind, this component is perfect for a wide range of applications, from industrial automation to consumer electronics. Benefit from Texas Instrument's reputation for excellence and trust in their cutting-edge technology to enhance your projects. Experience the value and advantages this product brings, providing you with the edge you need to succeed in today's competitive market. Partner with Texas Instruments and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic material provides better thermal stability and reliability, making this product suitable for applications where temperature variations are a concern.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration into existing circuit designs and layouts, enhancing overall compatibility and ease of use.

No. of Terminals: 48

With a high number of terminals, this product offers more connectivity options and flexibility for complex circuit configurations and designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can perform reliably in environments with elevated temperatures, expanding its range of potential applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature makes this product suitable for use in a wide range of environments, from standard room temperature conditions to colder settings.

Technology: TTL

The use of TTL technology ensures fast response times and high reliability, making this product ideal for applications where speed and accuracy are critical.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy compatibility with other components and circuit boards, simplifying the integration process and reducing the risk of errors.

Technical Specifications

Digital Arithmetic Circuits SN74ALS635J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS635J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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