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SN74ALS526N

Texas Instruments

SN74ALS526N by Texas Instruments

SN74ALS526N by Texas Instruments is a 16-bit digital arithmetic circuit with 15ns propagation delay. Operating at 5V, it has inverted output polarity and can handle load capacitance of 50pF. This TTL technology chip is commonly used in commercial applications requiring fast arithmetic calculations.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 5,792 parts In-Stock

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Digiode

USA . 412 parts In-Stock

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Prism Electronics

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Digital Electronic Gebert Verwaltungs UG

Germany . 10 parts In-Stock

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MISTER SPROCKETS

USA . 5 parts In-Stock

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Andel Nordic

Denmark . 3,304 parts In-Stock

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$5.040

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$4.838

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$4.838

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AZTECH Wire

Italy . 232 parts In-Stock

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$9.471

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Parana Technologies

USA . 1,898 parts In-Stock

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$14.328

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DigiPath Technology Company

USA . 1,852 parts In-Stock

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$15.777

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ChromeModa Solutions

Germany . 2,973 parts In-Stock

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$16.099

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$13.201

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

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$16.099

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$14.489

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One Stop Electronics

USA . 759 parts In-Stock

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Corphita

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Assy Fe

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Perfect Parts

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Overview

Unlock precision and reliability with the SN74ALS526N by Texas Instruments. As a leading manufacturer in digital arithmetic circuits, Texas Instruments delivers unparalleled quality and performance that exceeds expectations. Ideal for various applications, this 16-bit device offers unmatched value to customers seeking fast and efficient operations. Experience seamless functionality with this innovative solution that provides exceptional benefits and advantages, making it a top choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal circuitry, making the product reliable for long-term use.

No. of Bits: 16

Having 16 bits allows for higher precision and accuracy in digital arithmetic calculations, making the product suitable for complex computational tasks.

Nominal Supply Voltage / Vsup (V): 5V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of electronic systems and makes integration easier.

Propagation Delay (tpd): 15 ns

The low propagation delay of 15ns enables fast processing of arithmetic operations, improving overall performance and efficiency.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL-based systems, offering ease of integration and interoperability.

Technical Specifications

Digital Arithmetic Circuits SN74ALS526N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FUSE PROGRAMMABLE INPUTS

Family:

ALS

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74ALS526N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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