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SN74AS264FN

Texas Instruments

SN74AS264FN by Texas Instruments

SN74AS264FN by Texas Instruments is a TTL digital arithmetic circuit in a 20-terminal chip carrier package. Operating temperature range of 0-70°C, suitable for commercial applications. Features J bend terminals and surface mount capability, ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,250 parts In-Stock

1+ parts

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8,250

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Digiode

USA . 4,815 parts In-Stock

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4,815

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,684 parts In-Stock

1+ parts

$4.916

100+ parts

-

1k+ parts

$4.719

10k+ parts

$4.719

1,684

$4.916

-

$4.719

$4.719

AZTECH Wire

Italy . 503 parts In-Stock

1+ parts

$8.376

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503

$8.376

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Parana Technologies

USA . 2,249 parts In-Stock

1+ parts

$9.739

100+ parts

-

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$10.318

10k+ parts

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2,249

$9.739

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$10.318

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DigiPath Technology Company

USA . 1,935 parts In-Stock

1+ parts

$10.724

100+ parts

$9.866

1k+ parts

-

10k+ parts

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1,935

$10.724

$9.866

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ChromeModa Solutions

Germany . 4,834 parts In-Stock

1+ parts

$10.943

100+ parts

$8.973

1k+ parts

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4,834

$10.943

$8.973

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

1+ parts

$10.943

100+ parts

$10.396

1k+ parts

$9.849

10k+ parts

-

1,226

$10.943

$10.396

$9.849

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One Stop Electronics

USA . 1,639 parts In-Stock

1+ parts

$23.000

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1,639

$23.000

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Corphita

USA . 3,360 parts In-Stock

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3,360

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74AS264FN digital arithmetic circuit. This versatile chip carrier offers a wide range of applications, providing customers with enhanced performance and efficiency in their projects. With a temperature grade suitable for commercial use and a durable plastic/epoxy package body, this product is designed to withstand demanding conditions while delivering exceptional results. Trust Texas Instruments for innovative solutions that elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the circuit lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape ensures uniformity in size, making it easier to handle and integrate into circuit designs.

No. of Terminals: 20

Having 20 terminals provides flexibility in connection options, allowing for more complex circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and provides good thermal conductivity, ensuring optimal performance of the circuit.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the circuit can function in cold temperatures without issues.

Terminal Position: QUAD

The quad terminal position offers better connectivity and ease of soldering, enhancing the reliability and longevity of the circuit.

Temperature Grade: COMMERCIAL

Being commercial grade means the circuit is suitable for standard commercial applications where consistent performance is required.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making the circuit energy-efficient and reliable.

Terminal Form: J BEND

The J bend terminal form ensures secure connections and easy insertion into the circuit board, reducing the risk of disconnection.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27mm allows for high-density mounting, saving space on the circuit board and enabling more compact designs.

Technical Specifications

Digital Arithmetic Circuits SN74AS264FN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74AS264FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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