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TIM99631N

Texas Instruments

TIM99631N by Texas Instruments

TIM99631N by Texas Instruments is a Digital Arithmetic Circuit with 28 terminals in an IN-LINE package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes TTL technology and through-hole terminal form, ideal for various digital arithmetic tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,583 parts In-Stock

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6,583

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Digiode

USA . 4,942 parts In-Stock

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4,942

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Distributors (Availability)

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Andel Nordic

Denmark . 5,305 parts In-Stock

1+ parts

$1.337

100+ parts

-

1k+ parts

$1.283

10k+ parts

$1.283

5,305

$1.337

-

$1.283

$1.283

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$5.682

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386

$5.682

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Parana Technologies

USA . 1,833 parts In-Stock

1+ parts

$7.625

100+ parts

-

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$8.145

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1,833

$7.625

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$8.145

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$8.396

100+ parts

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1,100

$8.396

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ChromeModa Solutions

Germany . 6,405 parts In-Stock

1+ parts

$8.567

100+ parts

$7.025

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6,405

$8.567

$7.025

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$8.567

100+ parts

$8.139

1k+ parts

$7.710

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2,287

$8.567

$8.139

$7.710

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One Stop Electronics

USA . 510 parts In-Stock

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$62.000

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510

$62.000

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Corphita

USA . 3,745 parts In-Stock

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3,745

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Overview

Upgrade your digital arithmetic circuits with the high-quality TIM99631N from Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers reliable and efficient products that meet the demands of various applications in the industry. With its advanced technology and commercial-grade temperature tolerance, this product offers unmatched value and benefits to customers looking for precision and performance. Experience the advantages of the TIM99631N and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good physical protection for the circuit, ensuring durability and longevity.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs and layouts.

No. of Terminals: 28

Having 28 terminals allows for a versatile range of connections and input/output options.

Package Style (Meter): IN-LINE

In-line package style makes it convenient for mounting on PCBs and other circuit boards.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability even in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the circuit can function in a wide range of conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard commercial applications.

Technology: TTL

Use of TTL technology offers high speed and reliable operation in digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto PCBs.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch makes it compatible with commonly used connectors and boards.

Technical Specifications

Digital Arithmetic Circuits TIM99631N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIM99631N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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