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TIM99630J

Texas Instruments

TIM99630J by Texas Instruments

TIM99630J by Texas Instruments is a digital arithmetic circuit with 28 terminals in an inline rectangular ceramic package. Operating temperature range of 0-70°C, commercial grade TTL technology. Ideal for applications requiring precise arithmetic calculations in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,883 parts In-Stock

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2,883

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Digiode

USA . 276 parts In-Stock

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276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 493 parts In-Stock

1+ parts

$11.071

100+ parts

-

1k+ parts

$10.628

10k+ parts

$10.628

493

$11.071

-

$10.628

$10.628

Parana Technologies

USA . 1,969 parts In-Stock

1+ parts

$13.199

100+ parts

-

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$13.704

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1,969

$13.199

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$13.704

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$14.533

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221

$14.533

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ChromeModa Solutions

Germany . 2,005 parts In-Stock

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$14.830

100+ parts

$12.161

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2,005

$14.830

$12.161

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IDEA Electronic Components Group

UK . 669 parts In-Stock

1+ parts

$14.830

100+ parts

$14.088

1k+ parts

$13.347

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669

$14.830

$14.088

$13.347

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AZTECH Wire

Italy . 557 parts In-Stock

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$16.432

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557

$16.432

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One Stop Electronics

USA . 1,524 parts In-Stock

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$56.000

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1,524

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Corphita

USA . 249 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the TIM99630J from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package with 28 terminals. Ideal for commercial applications, this TTL device boasts a wide operating temperature range and dual terminal position for maximum flexibility. Experience seamless performance and unparalleled precision with the TIM99630J – the perfect choice for all your arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high temperature resistance, making it ideal for high-performance digital arithmetic circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and efficient use of space in electronic devices.

No. of Terminals: 28

Having 28 terminals allows for a greater level of connectivity and functionality in the digital arithmetic circuit.

Package Style (Meter): IN-LINE

In-line package style offers a compact and streamlined design that is easy to install and connect in electronic systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this digital arithmetic circuit can withstand demanding operational conditions without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the circuit to other components.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that this digital arithmetic circuit is suitable for typical commercial applications.

Technology: TTL

TTL technology offers high speed and reliability in digital signal processing, making this circuit suitable for fast computational tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is easy to solder and secure, ensuring a stable connection in the electronic circuit.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with other components and circuit boards, facilitating the assembly process.

Technical Specifications

Digital Arithmetic Circuits TIM99630J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIM99630J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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