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TIM9907N

Texas Instruments

TIM9907N by Texas Instruments

TIM9907N by Texas Instruments is a 9-bit digital arithmetic circuit with a 5V supply voltage. It features a propagation delay of 25ns and operates in temperatures ranging from 0 to 70°C. This TTL technology chip is commonly used in commercial applications requiring fast arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,381 parts In-Stock

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5,381

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Digiode

USA . 1,549 parts In-Stock

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1,549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 372 parts In-Stock

1+ parts

$6.662

100+ parts

-

1k+ parts

$6.396

10k+ parts

$6.396

372

$6.662

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$6.396

$6.396

Parana Technologies

USA . 1,805 parts In-Stock

1+ parts

$12.753

100+ parts

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$13.217

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1,805

$12.753

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$13.217

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DigiPath Technology Company

USA . 2,046 parts In-Stock

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$14.042

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$14.042

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IDEA Electronic Components Group

UK . 1,359 parts In-Stock

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$14.329

100+ parts

$13.613

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$12.896

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1,359

$14.329

$13.613

$12.896

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ChromeModa Solutions

Germany . 22 parts In-Stock

1+ parts

$14.329

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$11.750

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22

$14.329

$11.750

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One Stop Electronics

USA . 367 parts In-Stock

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$15.000

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367

$15.000

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AZTECH Wire

Italy . 475 parts In-Stock

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$19.623

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$19.623

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Corphita

USA . 4,624 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the TIM9907N by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for a variety of applications. With 9 bits and a nominal supply voltage of 5V, this rectangular-shaped package offers fast propagation delay and operates in a wide temperature range. Whether you're working on industrial automation or consumer electronics, the TIM9907N provides unmatched value and performance. Upgrade your projects today with Texas Instruments' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product's longevity and performance.

No. of Bits: 9

With 9 bits, this product can handle a wide range of numerical calculations with precision.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard 5V supply voltage, making it compatible with most systems.

Propagation Delay (tpd): 25 ns

With a low propagation delay, this product can quickly process arithmetic operations for optimal speed.

Temperature Grade: COMMERCIAL

Suitable for commercial use, ensuring reliability and stability in everyday applications.

Technology: TTL

Utilizing TTL technology provides high-speed operation and compatibility with a wide range of devices.

Technical Specifications

Digital Arithmetic Circuits TIM9907N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TIM9907N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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