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SN74H183J4

Texas Instruments

SN74H183J4 by Texas Instruments

SN74H183J4 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring dual terminal positions. With a terminal pitch of 2.54mm, this component is ideal for various electronic systems needing precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,249 parts In-Stock

1+ parts

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6,249

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Digiode

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,508 parts In-Stock

1+ parts

$7.903

100+ parts

-

1k+ parts

$8.459

10k+ parts

-

1,508

$7.903

-

$8.459

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Andel Nordic

Denmark . 1,694 parts In-Stock

1+ parts

$8.359

100+ parts

-

1k+ parts

$8.025

10k+ parts

$8.025

1,694

$8.359

-

$8.025

$8.025

DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$8.702

100+ parts

$8.006

1k+ parts

-

10k+ parts

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2,236

$8.702

$8.006

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ChromeModa Solutions

Germany . 6,255 parts In-Stock

1+ parts

$8.880

100+ parts

$7.282

1k+ parts

-

10k+ parts

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6,255

$8.880

$7.282

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IDEA Electronic Components Group

UK . 993 parts In-Stock

1+ parts

$8.880

100+ parts

$8.436

1k+ parts

$7.992

10k+ parts

-

993

$8.880

$8.436

$7.992

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AZTECH Wire

Italy . 751 parts In-Stock

1+ parts

$16.755

100+ parts

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751

$16.755

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One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$46.000

100+ parts

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1,155

$46.000

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Corphita

USA . 2,272 parts In-Stock

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2,272

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Overview

Upgrade your digital arithmetic circuits with the SN74H183J4 by Texas Instruments. Manufactured with precision and quality in mind, this product offers outstanding performance and reliability. Ideal for a wide range of applications, this versatile component is designed to meet the demanding needs of today's technology-driven world. Trust in Texas Instruments to deliver exceptional value and benefits to customers, ensuring that your projects run smoothly and efficiently. Elevate your designs with the SN74H183J4 and experience the advantages of working with a trusted industry leader.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties, making this product suitable for high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and efficient use of space.

No. of Terminals: 14

Having 14 terminals provides versatility and compatibility with a wide range of applications.

Package Style (Meter): IN-LINE

In-line package style is convenient for installation and maintenance of the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product is reliable in various temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments.

Temperature Grade: COMMERCIAL

Commercial grade temperature tolerance is suitable for standard commercial applications.

Technology: TTL

TTL technology offers compatibility with a wide range of digital systems and devices.

Terminal Position: DUAL

Dual terminal position allows for secure connections and reliability in circuit board layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides easy soldering and strong mechanical connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm enables easy integration and compatibility with existing circuit board designs.

Technical Specifications

Digital Arithmetic Circuits SN74H183J4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74H183J4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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