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SN74HC682J4

Texas Instruments

SN74HC682J4 by Texas Instruments

SN74HC682J4 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies of 2/6V, it comes in a rectangular ceramic package ideal for through-hole mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,657 parts In-Stock

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7,657

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Digiode

USA . 3,920 parts In-Stock

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3,920

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Distributors (Availability)

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Andel Nordic

Denmark . 733 parts In-Stock

1+ parts

$7.899

100+ parts

-

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$7.583

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$7.583

733

$7.899

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$7.583

$7.583

AZTECH Wire

Italy . 635 parts In-Stock

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$11.983

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635

$11.983

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Parana Technologies

USA . 248 parts In-Stock

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$22.988

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$23.636

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248

$22.988

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$23.636

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DigiPath Technology Company

USA . 1,861 parts In-Stock

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$25.312

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1,861

$25.312

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IDEA Electronic Components Group

UK . 591 parts In-Stock

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$25.829

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$24.538

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$23.246

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591

$25.829

$24.538

$23.246

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ChromeModa Solutions

Germany . 134 parts In-Stock

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$25.829

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$21.180

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134

$25.829

$21.180

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One Stop Electronics

USA . 1,133 parts In-Stock

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$61.000

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Corphita

USA . 2,014 parts In-Stock

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2,014

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Overview

Discover the unmatched quality and reliability of the Texas Instruments SN74HC682J4 digital arithmetic circuit, perfect for a wide range of industrial applications. With a package body material made of ceramic and a maximum operating temperature of 85°C, this innovative product offers superior performance and durability. From precision calculations to data processing, this versatile circuit provides exceptional value and benefits to customers looking for a reliable solution for their electronic needs. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making it ideal for high temperature environments and ensuring reliable performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy integration into electronic systems.

Power Supplies (V): 2/6

Supports a wide range of power supplies, providing flexibility in various application scenarios.

No. of Terminals: 20

Sufficient number of terminals for connecting to other components, enabling versatility in circuit design.

Package Style (Meter): IN-LINE

In-line package style facilitates easy wiring and organization of circuits, simplifying installation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions and ensure stability under heat.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves reliability by providing multiple connection points.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures suitability for rugged industrial applications where performance under extreme conditions is critical.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and signal integrity.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with common prototyping boards and components, enabling straightforward circuit assembly.

Technical Specifications

Digital Arithmetic Circuits SN74HC682J4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC682J4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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