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SN74HC147DW

Texas Instruments

SN74HC147DW by Texas Instruments

SN74HC147DW by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it is ideal for surface mount designs requiring precise numerical computations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,361 parts In-Stock

1+ parts

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7,361

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Digiode

USA . 2,534 parts In-Stock

1+ parts

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2,534

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$5.006

100+ parts

-

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817

$5.006

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Andel Nordic

Denmark . 1,362 parts In-Stock

1+ parts

$9.507

100+ parts

-

1k+ parts

$9.126

10k+ parts

$9.126

1,362

$9.507

-

$9.126

$9.126

Parana Technologies

USA . 2,061 parts In-Stock

1+ parts

$20.667

100+ parts

-

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$20.784

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2,061

$20.667

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$20.784

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ChromeModa Solutions

Germany . 5,474 parts In-Stock

1+ parts

$23.221

100+ parts

$19.041

1k+ parts

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5,474

$23.221

$19.041

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

1+ parts

$23.221

100+ parts

$22.060

1k+ parts

$20.899

10k+ parts

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1,472

$23.221

$22.060

$20.899

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One Stop Electronics

USA . 1,073 parts In-Stock

1+ parts

$53.000

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1,073

$53.000

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Corphita

USA . 3,238 parts In-Stock

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3,238

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DigiPath Technology Company

USA . 542 parts In-Stock

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$20.936

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542

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$20.936

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the SN74HC147DW digital arithmetic circuit. This innovative product offers a wide range of applications in various industries, providing customers with unmatched value and benefits. With a focus on performance and efficiency, this product is designed to meet all your digital arithmetic circuit needs. Trust Texas Instruments for superior technology and excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing overall assembly time.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the circuit board and facilitates easier placement during the manufacturing process.

Power Supplies (V): 2/6

The dual power supply options of 2V and 6V provide flexibility in voltage selection, catering to different system requirements and allowing for versatile applications.

No. of Terminals: 16

With 16 terminals available, the circuit can accommodate a range of input and output connections, enabling complex arithmetic operations and data processing.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for applications where size constraints are a concern while still providing high performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in demanding industrial environments, enhancing the product's robustness and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the circuit to function effectively in extreme cold conditions, making it suitable for a wide range of operating environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit board layout and connection options, enhancing ease of installation and enabling customization according to specific design requirements.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the circuit can sustain harsh environmental conditions typically encountered in industrial settings, guaranteeing reliable performance over extended periods.

Technology: CMOS

The CMOS technology used in the circuit ensures low power consumption, high noise immunity, and reliable operation, making it an efficient and dependable choice for digital arithmetic applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and strong mechanical connections, enhancing the overall reliability and durability of the product.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting, enabling efficient use of space on the circuit board and supporting complex circuit designs.

Technical Specifications

Digital Arithmetic Circuits SN74HC147DW attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC147DW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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