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SN74LS688NSRG4

Texas Instruments

SN74LS688NSRG4 by Texas Instruments

SN74LS688NSRG4 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It features a propagation delay of 23ns and operates in temperatures ranging from 0 to 70°C. This TTL technology chip is commonly used in applications requiring fast arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,760 parts In-Stock

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Digiode

USA . 1,339 parts In-Stock

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1,339

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Andel Nordic

Denmark . 2,333 parts In-Stock

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$5.348

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-

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$5.134

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$5.134

2,333

$5.348

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$5.134

$5.134

AZTECH Wire

Italy . 363 parts In-Stock

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$11.152

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Parana Technologies

USA . 1,885 parts In-Stock

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$17.365

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$17.571

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DigiPath Technology Company

USA . 642 parts In-Stock

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$19.121

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$17.591

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642

$19.121

$17.591

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ChromeModa Solutions

Germany . 2,375 parts In-Stock

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$19.511

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$15.999

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$19.511

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

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$19.511

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$18.535

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$17.560

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1,993

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One Stop Electronics

USA . 1,294 parts In-Stock

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$39.000

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Ampacity Inc.

Singapore . 622 parts In-Stock

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Corphita

USA . 2,187 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Enhance your digital circuit designs with the SN74LS688NSRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the realm of Digital Arithmetic Circuits. This versatile product offers 8 bits of precision, a nominal supply voltage of 5V, and a fast propagation delay of just 23 ns. Perfect for a wide range of applications, this small outline package is surface mountable and operates within a commercial temperature grade. Trust Texas Instruments to provide you with the tools you need to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability in various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy installation and compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and efficient placement on circuit boards.

No. of Bits: 8

With 8 bits, this digital arithmetic circuit is capable of processing a wide range of data and performing complex calculations efficiently.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources and reliable operation.

Power Supplies (V): 5

The 5V power supply ensures stable and consistent performance of the circuit.

No. of Terminals: 20

With 20 terminals, this circuit provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting on PCBs.

Propagation Delay (tpd): 23 ns

The low propagation delay of 23 ns ensures fast operation and reduced latency in data processing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the circuit can function in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection to the circuit board.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm enables a compact design and efficient use of space in the circuit layout.

Width: 5.3 mm

The width of 5.3mm ensures compatibility with standard spacing requirements on PCBs.

Output Polarity: INVERTED

The inverted output polarity allows for versatile integration with other components in the system.

Minimum Supply Voltage (Vsup): 4.85 V

The minimum supply voltage of 4.85V ensures reliable operation even under low power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and assembly of the circuit.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering during manufacturing processes.

Length: 12.6 mm

The length of 12.6mm provides a compact form factor suitable for various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions.

Technology: TTL

The TTL technology used in this circuit offers high-speed operation and compatibility with existing systems.

Terminal Form: GULL WING

The gull wing terminal form allows for secure soldering and stable connection to the circuit board.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides easy integration and compatibility with standard PCB layouts.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V ensures safe operation within the specified voltage limits.

Technical Specifications

Digital Arithmetic Circuits SN74LS688NSRG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON Q INPUTS; WITH P = Q & P > Q OUTPUTS

Family:

LS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.85 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LS688NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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