Loading...

SNC54HC147FH

Texas Instruments

SNC54HC147FH by Texas Instruments

SNC54HC147FH by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. It operates b/w -55°C to 125°C, with power supplies of 2V to 6V. With MIL-STD-883 Class B screening, it's ideal for military applications requiring high reliability and performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,673

-

-

-

-

Digiode

USA . 841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 487 parts In-Stock

1+ parts

$3.163

100+ parts

-

1k+ parts

$3.036

10k+ parts

$3.036

487

$3.163

-

$3.036

$3.036

AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$9.850

100+ parts

-

1k+ parts

-

10k+ parts

-

453

$9.850

-

-

-

One Stop Electronics

USA . 1,383 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,383

$11.000

-

-

-

Parana Technologies

USA . 947 parts In-Stock

1+ parts

$29.114

100+ parts

-

1k+ parts

$55.565

10k+ parts

-

947

$29.114

-

$55.565

-

ChromeModa Solutions

Germany . 1,445 parts In-Stock

1+ parts

$32.712

100+ parts

$26.824

1k+ parts

-

10k+ parts

-

1,445

$32.712

$26.824

-

-

IDEA Electronic Components Group

UK . 219 parts In-Stock

1+ parts

$32.712

100+ parts

$31.076

1k+ parts

$29.441

10k+ parts

-

219

$32.712

$31.076

$29.441

-

Corphita

USA . 627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

627

-

-

-

-

DigiPath Technology Company

USA . 477 parts In-Stock

1+ parts

-

100+ parts

$29.493

1k+ parts

-

10k+ parts

-

477

-

$29.493

-

-

Overview

Elevate your digital arithmetic circuits with the SNC54HC147FH by Texas Instruments, a high-quality product designed to meet the stringent standards of MIL-STD-883 Class B. With its ceramic package body material and advanced CMOS technology, this chip carrier offers unparalleled reliability and performance in military-grade applications. From precision calculations to data processing, this versatile component provides unmatched value and benefits to customers seeking top-of-the-line digital arithmetic circuits for their projects. Trust Texas Instruments for excellence in every terminal position, from quad to no lead, ensuring your operations run smoothly in extreme temperatures from -55°C to 125°C.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conduction and heat dissipation, making them ideal for high-performance applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the circuit, saving space and reducing overall size.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening ensures high reliability and quality of the product, making it suitable for critical military or aerospace applications.

Package Shape: SQUARE

Square packages are easier to handle and mount, providing a more stable and secure connection in the circuit.

Power Supplies (V): 2/6

The dual power supply options allow for versatile operation and compatibility with different voltage requirements, offering flexibility in various applications.

No. of Terminals: 20

The high number of terminals enables complex connectivity and integration of multiple components within the circuit, enhancing functionality and performance.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide a compact and robust housing for the circuit, protecting the components and ensuring reliable operation in harsh environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for consistent and reliable performance even in extreme conditions, ensuring durability and longevity.

Minimum Operating Temperature: -55 °C

The wide operating temperature range enables the circuit to function effectively in both hot and cold environments, enhancing versatility and usability.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient and secure connections in the circuit layout, ensuring stable and reliable electrical contacts.

Temperature Grade: MILITARY

Military-grade temperature rating ensures robustness and resilience of the circuit in demanding operational environments, meeting stringent quality and reliability standards.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and excellent noise immunity, making the circuit energy-efficient and reliable in digital arithmetic operations.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces health hazards, making the product eco-friendly and safe for use.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density packaging and precise electrical connections, enhancing the efficiency and performance of the circuit.

Technical Specifications

Digital Arithmetic Circuits SNC54HC147FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54HC147FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20