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SNJ54AS181BFK

Texas Instruments

SNJ54AS181BFK by Texas Instruments

SNJ54AS181BFK by Texas Instruments is a 4-bit digital arithmetic circuit with 14.5 ns propagation delay and 3-STATE output characteristics. It operates in a temperature range of -55 to 125 °C and is suitable for military applications requiring fast data processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,376 parts In-Stock

1+ parts

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3,376

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Digiode

USA . 132 parts In-Stock

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132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,760 parts In-Stock

1+ parts

$2.285

100+ parts

-

1k+ parts

$2.193

10k+ parts

$2.193

1,760

$2.285

-

$2.193

$2.193

AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$17.674

100+ parts

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565

$17.674

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Parana Technologies

USA . 2,141 parts In-Stock

1+ parts

$29.087

100+ parts

-

1k+ parts

$55.300

10k+ parts

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2,141

$29.087

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$55.300

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One Stop Electronics

USA . 1,023 parts In-Stock

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$32.000

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1,023

$32.000

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ChromeModa Solutions

Germany . 2,736 parts In-Stock

1+ parts

$32.682

100+ parts

$26.799

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2,736

$32.682

$26.799

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$32.682

100+ parts

$31.048

1k+ parts

$29.414

10k+ parts

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2,302

$32.682

$31.048

$29.414

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Corphita

USA . 2,741 parts In-Stock

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2,741

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DigiPath Technology Company

USA . 244 parts In-Stock

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$29.466

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244

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$29.466

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Overview

Unlock the power of precision with the SNJ54AS181BFK by Texas Instruments. Crafted with expert care and cutting-edge technology, this digital arithmetic circuit offers unparalleled reliability and performance. Ideal for a variety of applications, this versatile chip carrier is designed to exceed expectations. Discover the value of seamless integration and efficiency in your projects with the SNJ54AS181BFK. Elevate your work to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent reliability and durability for long-term usage.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

No. of Bits: 4

Suitable for applications requiring moderate precision and accuracy.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently within standard voltage ranges, ensuring compatibility.

Propagation Delay (tpd): 14.5 ns

Provides fast response times for real-time processing requirements.

Output Characteristics: 3-STATE

Offers flexibility in output control for diverse circuit configurations.

Temperature Grade: MILITARY

Designed to meet stringent military-grade standards for reliability in harsh environments.

Technical Specifications

Digital Arithmetic Circuits SNJ54AS181BFK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

AS

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

117 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

SNJ54AS181BFK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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