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M38510/34201B2A

Texas Instruments

M38510/34201B2A by Texas Instruments

M38510/34201B2A by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 10.5 ns at 5V, suitable for military applications. It features a max operating temperature of 125°C, MIL-PRF-38535 Class B screening level, and is surface mountable in a square chip carrier package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,071 parts In-Stock

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Digiode

USA . 4,004 parts In-Stock

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Anansix

USA . 668 parts In-Stock

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Andel Nordic

Denmark . 4,455 parts In-Stock

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$3.630

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$3.485

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$16.791

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$15.280

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$13.769

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AZTECH Wire

Italy . 653 parts In-Stock

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Parana Technologies

USA . 1,735 parts In-Stock

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DigiPath Technology Company

USA . 1,886 parts In-Stock

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$22.367

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$20.577

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ChromeModa Solutions

Germany . 3,003 parts In-Stock

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$18.715

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IDEA Electronic Components Group

UK . 1,831 parts In-Stock

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$21.682

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$20.541

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One Stop Electronics

USA . 1,455 parts In-Stock

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Corphita

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Overview

Unlock the power of cutting-edge technology with the M38510/34201B2A from Texas Instruments. This high-quality digital arithmetic circuit offers unparalleled performance and reliability, making it an ideal choice for a wide range of applications. Whether you're designing next-generation electronics or upgrading existing systems, this product delivers exceptional value, efficiency, and precision. Trust in Texas Instruments' legacy of innovation and quality to bring your projects to the next level with the M38510/34201B2A.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed package body material ensures durable and reliable performance, making it suitable for harsh operating conditions.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast processing speed, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Screening Level: MIL-PRF-38535 Class B

This screening level ensures that the product meets stringent military standards for quality and reliability.

No. of Bits: 4

4-bit resolution provides a good balance between performance and complexity, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most systems.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a 50 pF load capacitance, ensuring stable operation in various circuit configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures in challenging environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with existing TTL logic circuits, providing ease of integration.

Technical Specifications

Digital Arithmetic Circuits M38510/34201B2A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuit

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

M38510/34201B2A Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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