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SN74LS681FN3

Texas Instruments

SN74LS681FN3 by Texas Instruments

SN74LS681FN3 by Texas Instruments is a TTL digital arithmetic circuit in a 20-terminal chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. With J bend terminals and square shape, it is ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,033 parts In-Stock

1+ parts

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5,033

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Digiode

USA . 496 parts In-Stock

1+ parts

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496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,458 parts In-Stock

1+ parts

$8.676

100+ parts

-

1k+ parts

$8.329

10k+ parts

$8.329

1,458

$8.676

-

$8.329

$8.329

AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$11.697

100+ parts

-

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285

$11.697

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Parana Technologies

USA . 202 parts In-Stock

1+ parts

$19.641

100+ parts

-

1k+ parts

$19.633

10k+ parts

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202

$19.641

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$19.633

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DigiPath Technology Company

USA . 524 parts In-Stock

1+ parts

$21.627

100+ parts

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524

$21.627

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ChromeModa Solutions

Germany . 2,216 parts In-Stock

1+ parts

$22.068

100+ parts

$18.096

1k+ parts

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10k+ parts

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2,216

$22.068

$18.096

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IDEA Electronic Components Group

UK . 1,785 parts In-Stock

1+ parts

$22.068

100+ parts

$20.965

1k+ parts

$19.861

10k+ parts

-

1,785

$22.068

$20.965

$19.861

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One Stop Electronics

USA . 1,075 parts In-Stock

1+ parts

$36.000

100+ parts

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1,075

$36.000

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Corphita

USA . 1,285 parts In-Stock

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1,285

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Overview

Elevate your digital arithmetic circuits with the SN74LS681FN3 by Texas Instruments. Known for its high-quality manufacturing, Texas Instruments delivers reliable and efficient solutions for a wide range of applications. This versatile chip carrier package offers customers the value of superior performance, precision, and durability. Whether you're designing complex calculators or implementing intricate algorithms, this product provides the advantage you need to excel in your projects. Trust Texas Instruments to deliver top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the internal components of the digital arithmetic circuit, making it resistant to impacts and environmental factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the digital arithmetic circuit on a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package ensures a compact design, making it easier to integrate the digital arithmetic circuit into various electronic devices.

No. of Terminals: 20

With 20 terminals, this digital arithmetic circuit can support multiple connections and provide enhanced functionality for complex calculations.

Package Style: CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection to the internal components, ensuring optimal performance and longevity.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this digital arithmetic circuit can withstand high temperature conditions, making it suitable for various applications.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C allows this digital arithmetic circuit to function reliably even in cold environments.

Terminal Position: QUAD

Quad terminal position offers ease of connection and ensures secure and stable interactions with other components in the electronic system.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this digital arithmetic circuit is designed for standard commercial applications, providing cost-effective solutions for various projects.

Technology: TTL

TTL technology offers fast and reliable data transmission, ensuring accurate arithmetic calculations and efficient performance of the digital circuit.

Terminal Form: J BEND

J bend terminal form provides easy insertion and removal of the digital arithmetic circuit, facilitating maintenance and upgrades in the electronic system.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this digital arithmetic circuit allows for precise and secure connections, enhancing the overall stability and performance of the system.

Technical Specifications

Digital Arithmetic Circuits SN74LS681FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS681FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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