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SNC54ALS634JD

Texas Instruments

SNC54ALS634JD by Texas Instruments

SNC54ALS634JD by Texas Instruments is a 48-terminal TTL digital arithmetic circuit with MIL-STD-883 Class B screening. It operates b/w -55°C to 125°C, making it suitable for military applications requiring high temperature tolerance. The package style is in-line rectangular ceramic, ideal for robust and reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,202 parts In-Stock

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5,202

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Digiode

USA . 1,692 parts In-Stock

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1,692

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Distributors (Availability)

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Andel Nordic

Denmark . 5,351 parts In-Stock

1+ parts

$5.014

100+ parts

-

1k+ parts

$4.813

10k+ parts

$4.813

5,351

$5.014

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$4.813

$4.813

Parana Technologies

USA . 1,089 parts In-Stock

1+ parts

$7.859

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$8.415

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1,089

$7.859

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$8.415

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$8.653

100+ parts

$7.961

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786

$8.653

$7.961

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ChromeModa Solutions

Germany . 4,012 parts In-Stock

1+ parts

$8.830

100+ parts

$7.241

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4,012

$8.830

$7.241

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IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$8.830

100+ parts

$8.388

1k+ parts

$7.947

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113

$8.830

$8.388

$7.947

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AZTECH Wire

Italy . 638 parts In-Stock

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$16.125

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638

$16.125

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One Stop Electronics

USA . 1,031 parts In-Stock

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$29.000

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1,031

$29.000

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Corphita

USA . 236 parts In-Stock

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236

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Overview

Unleash the power of precision with the SNC54ALS634JD by Texas Instruments. Crafted with superior quality and expertise, this digital arithmetic circuit is designed to elevate your projects to new heights. Whether you're working on military-grade applications or seeking reliable TTL technology, this product delivers unmatched performance and durability. Experience seamless integration and enhanced functionality with the Texas Instruments advantage. Choose innovation, choose reliability, choose SNC54ALS634JD.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and resistance to high temperatures, making the product durable and reliable in challenging environments.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting MIL-STD-883 Class B standards ensures the product has undergone rigorous testing and quality control, resulting in a high level of reliability and performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient packaging and integration into various systems, optimizing space and functionality.

No. of Terminals: 48

Having a higher number of terminals allows for more complex circuit designs and functionalities, increasing the versatility and capabilities of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance under extreme heat.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function reliably in cold temperatures, providing consistent performance in a wide range of environments.

Terminal Position: DUAL

Dual terminal position allows for more flexibility in circuit connections and configurations, enabling easier installation and integration into different systems.

Temperature Grade: MILITARY

Military-grade temperature grade ensures the product meets stringent requirements for durability, reliability, and performance, making it suitable for demanding military applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, providing efficient and reliable operation for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and robust connections, enhancing the product's durability and stability in high-vibration environments.

Terminal Pitch: 2.54 mm

Having a standard terminal pitch of 2.54 mm ensures compatibility with common PCB layouts and components, facilitating easy integration and assembly in various electronic systems.

Technical Specifications

Digital Arithmetic Circuits SNC54ALS634JD attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54ALS634JD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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