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74AC11280J

Texas Instruments

74AC11280J by Texas Instruments

74AC11280J by Texas Instruments is a CMOS digital arithmetic circuit with 14 terminals, operating at temperatures from -40°C to 85°C. It has power supplies of 3.3/5V and comes in an IN-LINE package style. Ideal for industrial applications requiring precise calculations and logic operations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,833 parts In-Stock

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Digiode

USA . 597 parts In-Stock

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597

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Native Components

USA . 318 parts In-Stock

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$0.575

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318

$0.575

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Northwest PG Solutions

USA . 484 parts In-Stock

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$0.632

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484

$0.632

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AZTECH Wire

Italy . 639 parts In-Stock

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$18.742

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Parana Technologies

USA . 1,150 parts In-Stock

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$28.577

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$49.081

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$28.577

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$49.081

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ChromeModa Solutions

Germany . 5,595 parts In-Stock

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$32.109

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$26.329

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$32.109

$26.329

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IDEA Electronic Components Group

UK . 1,159 parts In-Stock

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$32.109

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$30.504

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$28.898

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1,159

$32.109

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$28.898

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Andel Nordic

Denmark . 559 parts In-Stock

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$46.124

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$44.279

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$44.279

559

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$44.279

One Stop Electronics

USA . 980 parts In-Stock

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$48.000

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980

$48.000

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Corphita

USA . 3,289 parts In-Stock

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DigiPath Technology Company

USA . 1,435 parts In-Stock

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$28.949

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$28.949

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments 74AC11280J. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in every product. Ideal for industrial applications, this CMOS technology circuit offers seamless integration and high performance. Experience the benefits of precision and efficiency with the 74AC11280J, designed to meet your needs and exceed your expectations. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and insulation, making it suitable for high-temperature operations.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and provides stability during installation.

Power Supplies (V): 3.3/5

Supports dual power supply voltages, offering flexibility in different circuit configurations.

No. of Terminals: 14

Provides a sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): IN-LINE

In-line package style allows for easy insertion and removal from a circuit board.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, increasing the range of applications for this product.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit connections and layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections to the circuit board, reducing the risk of disconnection.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with commonly used components and circuit boards.

Technical Specifications

Digital Arithmetic Circuits 74AC11280J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74AC11280J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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