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SN54184J-00

Texas Instruments

SN54184J-00 by Texas Instruments

SN54184J-00 by Texas Instruments is a 5-bit digital arithmetic circuit with a 35ns propagation delay. It operates in a temperature range of -55 to 125°C and has an open-collector output. This TTL technology device is commonly used in military-grade applications requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,238 parts In-Stock

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Digiode

USA . 3,108 parts In-Stock

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3,108

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Distributors (Availability)

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Andel Nordic

Denmark . 5,842 parts In-Stock

1+ parts

$6.600

100+ parts

-

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$6.336

10k+ parts

$6.336

5,842

$6.600

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$6.336

$6.336

AZTECH Wire

Italy . 534 parts In-Stock

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$15.276

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534

$15.276

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Parana Technologies

USA . 808 parts In-Stock

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$16.944

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$17.176

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808

$16.944

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$17.176

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DigiPath Technology Company

USA . 2,032 parts In-Stock

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$18.657

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2,032

$18.657

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ChromeModa Solutions

Germany . 2,819 parts In-Stock

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$19.038

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$15.611

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2,819

$19.038

$15.611

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

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$19.038

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$18.086

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$17.134

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1,295

$19.038

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$17.134

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One Stop Electronics

USA . 318 parts In-Stock

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$23.000

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$23.000

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Corphita

USA . 827 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the SN54184J-00 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch products that exceed expectations. This versatile device is perfect for a wide range of applications, offering customers unmatched performance and precision. Experience the value and benefits of this product, designed to enhance your projects and simplify your workload. Trust Texas Instruments to provide innovative solutions that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

No. of Bits: 5

Ideal for applications requiring moderate precision and complexity in calculations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for easy integration into existing systems.

Propagation Delay (tpd): 35 ns

Offers fast processing speed for efficient performance in time-sensitive operations.

Temperature Grade: MILITARY

Designed to operate reliably in demanding military environments with wide temperature ranges.

Technical Specifications

Digital Arithmetic Circuits SN54184J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

BINARY TO BCD CONVERTER

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54184J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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