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SN74ALS528D3

Texas Instruments

SN74ALS528D3 by Texas Instruments

SN74ALS528D3 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in a small outline package. It operates b/w 0°C to 70°C, suitable for commercial applications. This surface-mount device is designed for arithmetic operations in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,493 parts In-Stock

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8,493

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Digiode

USA . 4,956 parts In-Stock

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4,956

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,472 parts In-Stock

1+ parts

$7.378

100+ parts

-

1k+ parts

$7.083

10k+ parts

$7.083

2,472

$7.378

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$7.083

$7.083

AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$11.860

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423

$11.860

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Parana Technologies

USA . 1,719 parts In-Stock

1+ parts

$29.815

100+ parts

-

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$63.568

10k+ parts

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1,719

$29.815

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$63.568

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DigiPath Technology Company

USA . 1,663 parts In-Stock

1+ parts

$32.830

100+ parts

$30.204

1k+ parts

-

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1,663

$32.830

$30.204

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ChromeModa Solutions

Germany . 4,939 parts In-Stock

1+ parts

$33.500

100+ parts

$27.470

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4,939

$33.500

$27.470

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IDEA Electronic Components Group

UK . 1,170 parts In-Stock

1+ parts

$33.500

100+ parts

$31.825

1k+ parts

$30.150

10k+ parts

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1,170

$33.500

$31.825

$30.150

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One Stop Electronics

USA . 1,179 parts In-Stock

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$65.000

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1,179

$65.000

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Corphita

USA . 779 parts In-Stock

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779

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Overview

Experience superior performance and reliability with the SN74ALS528D3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver outstanding results. This digital arithmetic circuit is versatile and can be used in a variety of applications. With a small outline package and commercial temperature grade, this product offers convenience and efficiency. Trust Texas Instruments for innovative solutions that provide value and benefits to your projects. Upgrade your electronics with the SN74ALS528D3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the circuit, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto PCBs, saving space and improving overall manufacturing efficiency.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, making it easy to integrate into different electronic devices without taking up much space.

No. of Terminals: 16

With 16 terminals, this circuit can support multiple inputs and outputs, allowing for complex arithmetic calculations to be performed efficiently.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers a reduced footprint, ideal for applications where space is a constraint, such as in portable devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures the circuit can operate reliably in various temperature conditions without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the circuit can function properly even in colder environments, enhancing its versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options, allowing for different configurations to be implemented based on the application requirements.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the circuit is designed for standard commercial applications, offering a balance of performance and cost-effectiveness.

Technology: TTL

TTL technology offers fast and reliable digital arithmetic operations, making this circuit suitable for high-speed computation tasks.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs, ensuring a secure and stable connection for efficient electrical performance.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for precise placement on the PCB, enabling high-density circuit designs for enhanced functionality.

Technical Specifications

Digital Arithmetic Circuits SN74ALS528D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS528D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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