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SNJ54185AW

Texas Instruments

SNJ54185AW by Texas Instruments

SNJ54185AW by Texas Instruments is a digital arithmetic circuit with 16 terminals, operating at temperatures from -55°C to 125°C. It has a nominal voltage of 5V and is designed for military-grade applications. This TTL technology chip comes in a ceramic flatpack package suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,451 parts In-Stock

1+ parts

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3,451

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Vyrian

USA . 2,048 parts In-Stock

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2,048

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 217 parts In-Stock

1+ parts

$8.331

100+ parts

-

1k+ parts

$7.997

10k+ parts

$7.997

217

$8.331

-

$7.997

$7.997

AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$16.718

100+ parts

-

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654

$16.718

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Parana Technologies

USA . 157 parts In-Stock

1+ parts

$21.283

100+ parts

$1,976.409

1k+ parts

$19.154

10k+ parts

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157

$21.283

$1,976.409

$19.154

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DigiPath Technology Company

USA . 1,645 parts In-Stock

1+ parts

$23.435

100+ parts

$21.560

1k+ parts

-

10k+ parts

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1,645

$23.435

$21.560

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ChromeModa Solutions

Germany . 2,577 parts In-Stock

1+ parts

$23.913

100+ parts

$19.609

1k+ parts

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2,577

$23.913

$19.609

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IDEA Electronic Components Group

UK . 517 parts In-Stock

1+ parts

$23.913

100+ parts

$22.717

1k+ parts

$21.522

10k+ parts

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517

$23.913

$22.717

$21.522

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One Stop Electronics

USA . 407 parts In-Stock

1+ parts

$59.000

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407

$59.000

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Corphita

USA . 4,322 parts In-Stock

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4,322

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Overview

Elevate your digital arithmetic circuits with the SNJ54185AW by Texas Instruments. Crafted with precision and expertise, this high-quality product offers exceptional performance and reliability for a wide range of applications. From military-grade technology to a sleek flatpack design, this component is designed to meet and exceed your expectations. Unlock new possibilities and enhance your projects with the innovative features and benefits that the SNJ54185AW delivers. Trust in Texas Instruments for excellence in every circuit.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable material that provides better thermal properties, making this product suitable for military applications where robustness is crucial.

Surface Mount: YES

Surface mount technology allows for more efficient PCB assembly, reducing overall size and weight of the product.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance under extreme conditions, making this product ideal for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance of the digital arithmetic circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Technology: TTL

TTL technology offers high speed and reliability, making this product suitable for applications requiring fast computation.

Technical Specifications

Digital Arithmetic Circuits SNJ54185AW attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54185AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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