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SNC54LS283J

Texas Instruments

SNC54LS283J by Texas Instruments

SNC54LS283J by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates at a supply voltage of 5V and has a temperature range from -55°C to 125°C, suitable for military applications. The package style is in-line with 16 terminals and MIL-STD-883 Class B screening level.

Median Price

$6.958

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$6.958

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$7.306

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$6.888

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Vyrian

USA . 4,676 parts In-Stock

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Digiode

USA . 1,910 parts In-Stock

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Electronic Expediters

USA . 79 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 25 parts In-Stock

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A2Z Electronics, Inc.

USA . 23 parts In-Stock

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MISTER SPROCKETS

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Manoshevitz Elec. Sales

Israel . 2 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 251 parts In-Stock

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$10.806

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$10.373

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$10.373

251

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Parana Technologies

USA . 2,037 parts In-Stock

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$16.644

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DigiPath Technology Company

USA . 449 parts In-Stock

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AZTECH Wire

Italy . 231 parts In-Stock

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ChromeModa Solutions

Germany . 6,695 parts In-Stock

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$15.335

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IDEA Electronic Components Group

UK . 196 parts In-Stock

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$18.701

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$17.766

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One Stop Electronics

USA . 175 parts In-Stock

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Corphita

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Overview

Elevate your digital arithmetic circuits with the SNC54LS283J by Texas Instruments. Known for their superior quality and advanced technology, Texas Instruments delivers top-notch products that exceed industry standards. This versatile component is ideal for a wide range of applications, offering unmatched reliability and precision. Experience the value and benefits of this innovative product, designed to streamline operations and enhance performance. Upgrade your circuits with the SNC54LS283J and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its excellent thermal properties, making it ideal for high temperature applications and ensuring reliable performance over a wide temperature range.

Screening Level: MIL-STD-883 Class B (Modified)

This level of screening ensures quality and reliability of the product, making it suitable for critical military or aerospace applications where performance is crucial.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit is capable of performing basic arithmetic operations efficiently, making it a cost-effective choice for applications that do not require high precision calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this circuit is compatible with standard TTL logic levels, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this circuit can withstand high temperature environments, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range from -55°C to 125°C makes this circuit suitable for use in both extreme cold and hot environments, providing versatility in application.

Technology: TTL

Based on TTL technology, this circuit offers fast switching speeds and low power consumption, making it efficient for digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNC54LS283J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Bits:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS283J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-039-3453, 5962010393453

NIIN

010393453

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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