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SN54LS261J

Texas Instruments

SN54LS261J by Texas Instruments

SN54LS261J by Texas Instruments is a 4-bit digital arithmetic circuit with a supply voltage range of 4.5V to 5.5V and a propagation delay of 37ns. It operates in military-grade temperatures from -55°C to 125°C, making it suitable for robust applications requiring fast calculations in harsh environments. The package style is in-line with through-hole terminals, ideal for secure connections and reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,126 parts In-Stock

1+ parts

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3,126

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Digiode

USA . 2,031 parts In-Stock

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-

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2,031

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$5.716

100+ parts

-

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341

$5.716

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One Stop Electronics

USA . 1,134 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,134

$14.000

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Parana Technologies

USA . 2,046 parts In-Stock

1+ parts

$21.139

100+ parts

-

1k+ parts

$21.410

10k+ parts

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2,046

$21.139

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$21.410

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DigiPath Technology Company

USA . 199 parts In-Stock

1+ parts

$23.277

100+ parts

$21.415

1k+ parts

-

10k+ parts

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199

$23.277

$21.415

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ChromeModa Solutions

Germany . 1,033 parts In-Stock

1+ parts

$23.752

100+ parts

$19.477

1k+ parts

-

10k+ parts

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1,033

$23.752

$19.477

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IDEA Electronic Components Group

UK . 851 parts In-Stock

1+ parts

$23.752

100+ parts

$22.564

1k+ parts

$21.377

10k+ parts

-

851

$23.752

$22.564

$21.377

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Corphita

USA . 1,293 parts In-Stock

1+ parts

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1,293

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Elevate your digital circuits with the SN54LS261J by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile 4-bit arithmetic circuit is designed to deliver precision and reliability, making it ideal for a wide range of applications. With a focus on value and performance, this product offers customers the benefits of speed, efficiency, and durability. Upgrade your projects with the SN54LS261J and experience superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal circuitry, making the product reliable for long-term use.

No. of Bits: 4

Having 4 bits allows for a higher level of precision in digital arithmetic operations, making the product suitable for various applications requiring accurate calculations.

Propogation Delay: 37 ns

With a low propagation delay, this product can perform arithmetic operations quickly, making it ideal for applications where speed is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can perform reliably in a wide range of environments, increasing its versatility.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems, enhancing the product's usability and flexibility in various setups.

Technical Specifications

Digital Arithmetic Circuits SN54LS261J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

2'S COMPLEMENT RECODE MULTIPLIER; PRODUCT RECODED AS BASE-4 NUMBER; LATCHED OUTPUTS

Family:

LS

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay (tpd):

37 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54LS261J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-478-7782, 5962144787782

NIIN

144787782

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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