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SN74HC148FH

Texas Instruments

SN74HC148FH by Texas Instruments

SN74HC148FH by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. It operates b/w -40°C to 85°C with power supplies of 2-6V. With 20 terminals and surface mount capability, it's ideal for industrial applications requiring precise arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,047

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-

-

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Digiode

USA . 904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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904

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,512 parts In-Stock

1+ parts

$2.356

100+ parts

-

1k+ parts

$2.262

10k+ parts

$2.262

4,512

$2.356

-

$2.262

$2.262

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$12.882

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$12.882

-

-

-

Parana Technologies

USA . 1,272 parts In-Stock

1+ parts

$26.576

100+ parts

-

1k+ parts

$27.147

10k+ parts

-

1,272

$26.576

-

$27.147

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ChromeModa Solutions

Germany . 2,866 parts In-Stock

1+ parts

$29.861

100+ parts

$24.486

1k+ parts

-

10k+ parts

-

2,866

$29.861

$24.486

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-

IDEA Electronic Components Group

UK . 10 parts In-Stock

1+ parts

$29.861

100+ parts

$28.368

1k+ parts

$26.875

10k+ parts

-

10

$29.861

$28.368

$26.875

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One Stop Electronics

USA . 1,127 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,127

$33.000

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-

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Corphita

USA . 2,476 parts In-Stock

1+ parts

-

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2,476

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DigiPath Technology Company

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

$26.923

1k+ parts

-

10k+ parts

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1,447

-

$26.923

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Overview

Experience superior quality and reliability with the SN74HC148FH by Texas Instruments, a leading manufacturer in the industry. This digital arithmetic circuit offers countless applications in various electronic devices, providing customers with unmatched value and benefits. Whether you're designing consumer electronics or industrial machinery, this product's advanced technology and high-performance features will elevate your projects to new heights. Trust Texas Instruments for exceptional products that deliver outstanding results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties and high reliability, ensuring stable operation in various conditions.

Surface Mount: YES

Surface mounting technology allows for easy integration onto circuit boards, saving space and enhancing manufacturability.

Power Supplies (V): 2/6

Supports a wide range of power supply voltages, making it versatile for different applications.

No. of Terminals: 20

Sufficient number of terminals for connectivity and functionality without being overly complex.

Package Style: CHIP CARRIER

Chip carrier package style offers protection and compactness, ideal for space-constrained environments.

Temperature Range: -40 to 85 °C

Wide operating temperature range suitable for industrial applications where extreme conditions may be encountered.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance and efficiency.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations, ensuring sustainability.

Technical Specifications

Digital Arithmetic Circuits SN74HC148FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC148FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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