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CD74HC147E

Texas Instruments

CD74HC147E by Texas Instruments

CD74HC147E by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 32ns at 4.5V supply, ideal for military-grade applications. It features a max operating temperature of 125°C, nickel/palladium/gold terminal finish, and CMOS technology in an inline package style.

Median Price

$0.519

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

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Texas Instruments

USA . 86,142 parts In-Stock

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DigiKey

USA . 2,253 parts In-Stock

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Mouser Electronics

USA . 1,189 parts In-Stock

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Verical

USA . 31 parts In-Stock

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Bürklin Elektronik

Germany . 24 parts In-Stock

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Chip1Stop

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Freelance Electronics

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Digiode

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TME

Poland . 568 parts In-Stock

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Chip Stock

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Sea View Technologies

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Ack Elektronik San.Tic.Ltd.Sti

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Goldney Electronics S.L.

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Semicontronic

India . 14,375 parts In-Stock

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$0.218

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$0.213

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Continental Prestige Electronics

USA . 3,528 parts In-Stock

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Argo Parts USA

USA . 2,737 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Component Stockers USA

USA . 105,411 parts In-Stock

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Corphita

USA . 2,971 parts In-Stock

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Microchip USA

USA . 9,068 parts In-Stock

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Parana Technologies

USA . 1,967 parts In-Stock

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$7.718

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DigiPath Technology Company

USA . 2,275 parts In-Stock

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ChromeModa Solutions

Germany . 6,207 parts In-Stock

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IDEA Electronic Components Group

UK . 1,429 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,720 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Netroflash

USA . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,871 parts In-Stock

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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Kepictronics

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Supply Digital

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Overview

Experience the unparalleled quality and precision of Texas Instruments with the CD74HC147E digital arithmetic circuit. Designed for efficiency and reliability, this product offers seamless integration into a variety of applications, making it a versatile choice for your electronic projects. Benefit from faster operation and enhanced performance while enjoying the peace of mind that comes with using a trusted manufacturer. Upgrade your circuits today with the CD74HC147E and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the digital arithmetic circuit.

No. of Bits: 9

Allows for processing of data with a higher level of precision and accuracy.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal voltage supply for efficient performance and power consumption.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of operating environments and conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Digital Arithmetic Circuits CD74HC147E attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

9 TO 4 LINE PRIORITY ENCODER

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC147E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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