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SN74F382D3

Texas Instruments

SN74F382D3 by Texas Instruments

SN74F382D3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals and a supply voltage of 5V. It operates in commercial temperature grade from 0 to 70°C, suitable for various applications requiring precise arithmetic calculations in electronics. This rectangular-shaped package with gull wing terminals is surface mountable, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,830 parts In-Stock

1+ parts

-

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8,830

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Digiode

USA . 4,943 parts In-Stock

1+ parts

-

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-

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4,943

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,044 parts In-Stock

1+ parts

$5.783

100+ parts

-

1k+ parts

$5.552

10k+ parts

$5.552

5,044

$5.783

-

$5.552

$5.552

AZTECH Wire

Italy . 776 parts In-Stock

1+ parts

$8.561

100+ parts

-

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776

$8.561

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Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$28.397

100+ parts

-

1k+ parts

$46.992

10k+ parts

-

1,476

$28.397

-

$46.992

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ChromeModa Solutions

Germany . 3,413 parts In-Stock

1+ parts

$31.907

100+ parts

$26.164

1k+ parts

-

10k+ parts

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3,413

$31.907

$26.164

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

1+ parts

$31.907

100+ parts

$30.312

1k+ parts

$28.716

10k+ parts

-

1,314

$31.907

$30.312

$28.716

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One Stop Electronics

USA . 263 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

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263

$33.000

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Corphita

USA . 2,479 parts In-Stock

1+ parts

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2,479

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DigiPath Technology Company

USA . 1,577 parts In-Stock

1+ parts

-

100+ parts

$28.767

1k+ parts

-

10k+ parts

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1,577

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$28.767

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Overview

Enhance your digital arithmetic circuits with the SN74F382D3 by Texas Instruments, a top-quality product designed to deliver unparalleled performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this chip offers exceptional value and benefits to customers. Ideal for a wide range of applications, this product is perfect for those looking for a high-quality solution that ensures seamless operation and efficiency in their electronic devices. Upgrade your circuitry with the SN74F382D3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the sensitive circuits inside the package, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into larger systems, enhancing the overall efficiency of the product.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with other components.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand prolonged use in various environments without risk of overheating or performance degradation.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making this product suitable for demanding arithmetic applications that require efficient processing.

Technical Specifications

Digital Arithmetic Circuits SN74F382D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74F382D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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