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SN74AS882NTP1

Texas Instruments

SN74AS882NTP1 by Texas Instruments

SN74AS882NTP1 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations and logic operations. The through-hole terminal form and 2.54mm pitch enhance its reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,377 parts In-Stock

1+ parts

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5,377

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Digiode

USA . 305 parts In-Stock

1+ parts

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305

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 384 parts In-Stock

1+ parts

$8.465

100+ parts

-

1k+ parts

$8.126

10k+ parts

$8.126

384

$8.465

-

$8.126

$8.126

AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$8.526

100+ parts

-

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379

$8.526

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Parana Technologies

USA . 1,350 parts In-Stock

1+ parts

$12.518

100+ parts

-

1k+ parts

$12.965

10k+ parts

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1,350

$12.518

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$12.965

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$13.784

100+ parts

$12.681

1k+ parts

-

10k+ parts

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1,053

$13.784

$12.681

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ChromeModa Solutions

Germany . 3,556 parts In-Stock

1+ parts

$14.065

100+ parts

$11.533

1k+ parts

-

10k+ parts

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3,556

$14.065

$11.533

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IDEA Electronic Components Group

UK . 1,057 parts In-Stock

1+ parts

$14.065

100+ parts

$13.362

1k+ parts

$12.658

10k+ parts

-

1,057

$14.065

$13.362

$12.658

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One Stop Electronics

USA . 582 parts In-Stock

1+ parts

$20.000

100+ parts

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582

$20.000

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Corphita

USA . 4,298 parts In-Stock

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4,298

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Overview

Enhance your digital arithmetic circuits with the SN74AS882NTP1 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This product offers unparalleled value, providing customers with superior performance and efficiency. Say goodbye to technical glitches and hello to seamless operations with the SN74AS882NTP1. Upgrade your circuitry today and experience the benefits firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing circuit designs.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting to other components and peripherals, enhancing the product's functionality.

Package Style (Meter): IN-LINE

In-line package style allows for easy installation and wiring in a circuit setup, improving overall system efficiency.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures the product's reliability in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a secure connection, minimizing the risk of signal loss or disruption.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making it suitable for a wide range of applications.

Technology: TTL

TTL technology offers high-speed performance and low power consumption, making the product ideal for digital arithmetic circuits that require fast and efficient calculations.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer a secure and reliable connection, making it easy to solder and integrate this product into a circuit board.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product is compatible with standard PCB layouts and allows for easy routing of connections, simplifying the assembly process.

Technical Specifications

Digital Arithmetic Circuits SN74AS882NTP1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS882NTP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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