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5962-88691012A

Texas Instruments

5962-88691012A by Texas Instruments

The Texas Instruments 5962-88691012A is an 8-bit digital arithmetic circuit with a propagation delay of 20 ns at 5V. It features a MIL-STD-883 screening level and operates in military-grade temperature range (-55 to 125 °C). This chip carrier package is suitable for applications requiring fast signal processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,540 parts In-Stock

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4,540

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Digiode

USA . 4,356 parts In-Stock

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4,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 596 parts In-Stock

1+ parts

$2.645

100+ parts

-

1k+ parts

$2.539

10k+ parts

$2.539

596

$2.645

-

$2.539

$2.539

AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$6.653

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474

$6.653

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Parana Technologies

USA . 790 parts In-Stock

1+ parts

$16.812

100+ parts

$1,561.258

1k+ parts

$15.131

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790

$16.812

$1,561.258

$15.131

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$18.512

100+ parts

$17.031

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1,910

$18.512

$17.031

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ChromeModa Solutions

Germany . 2,025 parts In-Stock

1+ parts

$18.890

100+ parts

$15.490

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2,025

$18.890

$15.490

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IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$18.890

100+ parts

$17.946

1k+ parts

$17.001

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1,498

$18.890

$17.946

$17.001

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One Stop Electronics

USA . 288 parts In-Stock

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$29.000

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288

$29.000

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Corphita

USA . 4,337 parts In-Stock

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Microchip USA

USA . 1,605 parts In-Stock

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1,605

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Northwest PG Solutions

USA . 1,056 parts In-Stock

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Native Components

USA . 816 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the 5962-88691012A by Texas Instruments. Crafted with precision and quality in mind, this MILITARY grade chip carrier offers high-performance capabilities for a wide range of applications. With its inverted output polarity and 3-STATE output characteristics, this TTL technology marvel delivers efficient processing with a propagation delay of just 25 ns. Trust in Texas Instruments to provide reliable and advanced solutions that bring value and benefits to your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material

CERAMIC, METAL-SEALED COFIRED - Provides durability and stability for the product, ensuring reliable performance under various conditions.

Propagation Delay At Nominal Supply

20 ns - Offers fast processing speed, making it suitable for applications where quick calculations are required.

Surface Mount

YES - Allows for easy and convenient integration into circuit boards without the need for additional connectors.

Screening Level

MIL-STD-883 - Meets stringent military standards for quality and reliability, ensuring consistent performance in demanding environments.

Package Shape

SQUARE - Offers a compact design that helps save space in circuit assemblies.

No. of Bits

8 - Provides sufficient precision for various arithmetic operations, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V)

5 - Operates at a standard voltage level commonly used in electronic systems, ensuring compatibility.

Load Capacitance (CL)

50 pF - Helps stabilize the circuit's operation by providing a proper load to the output.

Power Supplies (V)

5 - Requires a common voltage level for power, simplifying the power management setup.

No. of Terminals

20 - Offers multiple connection points for enhanced flexibility in circuit design.

Package Style (Meter)

CHIP CARRIER - Provides a robust and stable housing for the circuit, protecting it from external influences.

Maximum I (ol)

24 Amp - Can handle higher output currents, making it suitable for power-intensive applications.

Propagation Delay (tpd)

25 ns - Ensures quick response time for input signals, enhancing overall system performance.

Maximum Operating Temperature

125 °C - Can operate reliably in high-temperature environments without performance degradation.

Output Characteristics

3-STATE - Provides multiple output states, offering more versatility in controlling signal flow.

Minimum Operating Temperature

-55 °C - Can operate in extremely low-temperature conditions, suitable for a wide range of environments.

Terminal Finish

TIN LEAD - Offers good conductivity and corrosion resistance for reliable electrical connections.

Terminal Position

QUAD - Allows for easy alignment and connection with other components in the circuit setup.

Maximum Seated Height

2.03 mm - Provides a low-profile design for space-constrained applications.

Width

8.89 mm - Has a compact width, allowing for efficient usage of PCB space.

Output Polarity

INVERTED - Offers flexibility in signal processing by providing inverted output signals.

Minimum Supply Voltage (Vsup)

4.5 V - Can operate at lower voltages, saving power and extending battery life in portable devices.

Length

8.89 mm - Features a balanced length that matches the width for a square-shaped design.

Temperature Grade

MILITARY - Meets strict temperature requirements for military-grade applications, ensuring reliability in harsh conditions.

Technology

TTL - Utilizes transistor-transistor logic for fast and efficient arithmetic calculations.

Terminal Form

NO LEAD - Allows for direct mounting on the PCB without additional lead attachments.

Packing Method

TUBE - Provides secure packaging for transportation and storage, preventing damage to the product.

Terminal Pitch

1.27 mm - Offers standard spacing for terminals, facilitating easy assembly onto PCBs.

Maximum Supply Voltage (Vsup)

5.5 V - Can handle higher voltages if needed without risk of damage to the circuit.

Maximum Power Supply Current (ICC)

19 mA - Consumes low power for efficient operation and reduced heat dissipation.

Technical Specifications

Digital Arithmetic Circuits 5962-88691012A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON Q INPUTS; CASCADABLE

Family:

ALS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

25 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuit

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

5962-88691012A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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