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5962-86818012X

Texas Instruments

5962-86818012X by Texas Instruments

The Texas Instruments 5962-86818012X is an 8-bit digital arithmetic circuit with a supply voltage of 5V, operating temperature range from -55 to 125°C, and propagation delay of 313ns. It is designed for military-grade applications requiring inverted output polarity in a chip carrier package with quad terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,898 parts In-Stock

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3,898

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Anansix

USA . 1,906 parts In-Stock

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1,906

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Digiode

USA . 307 parts In-Stock

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307

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Distributors (Availability)

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Andel Nordic

Denmark . 986 parts In-Stock

1+ parts

$9.374

100+ parts

-

1k+ parts

$8.999

10k+ parts

$8.999

986

$9.374

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$8.999

$8.999

AZTECH Wire

Italy . 395 parts In-Stock

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$16.287

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395

$16.287

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Parana Technologies

USA . 46 parts In-Stock

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$30.084

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$66.850

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46

$30.084

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$66.850

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DigiPath Technology Company

USA . 1,408 parts In-Stock

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$33.126

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1,408

$33.126

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ChromeModa Solutions

Germany . 4,026 parts In-Stock

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$33.802

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$27.718

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4,026

$33.802

$27.718

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

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$33.802

100+ parts

$32.112

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$30.422

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1,888

$33.802

$32.112

$30.422

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One Stop Electronics

USA . 1,219 parts In-Stock

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$53.000

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$53.000

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Native Components

USA . 590 parts In-Stock

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$79.870

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$76.675

590

$79.870

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$76.675

Northwest PG Solutions

USA . 768 parts In-Stock

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$87.857

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768

$87.857

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Corphita

USA . 3,508 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the 5962-86818012X by Texas Instruments. Manufactured with top-quality materials and stringent screening levels, this chip carrier offers reliable performance in a wide range of military-grade applications. With a nominal supply voltage of 5V and a fast propagation delay of 313ns, this product provides customers with high-speed computing capabilities and precise calculations. Trust Texas Instruments for cutting-edge technology that delivers unmatched value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides excellent durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

No. of Bits: 8

With 8 bits, this digital arithmetic circuit can handle a wide range of numerical operations with precision.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Propagation Delay (tpd): 313 ns

The low propagation delay of 313 ns ensures fast and efficient operation of the circuit.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product offers exceptional performance and reliability in demanding environments.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making it suitable for a wide range of applications.

Technical Specifications

Digital Arithmetic Circuits 5962-86818012X attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

313 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

5962-86818012X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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