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SN74S281FN3

Texas Instruments

SN74S281FN3 by Texas Instruments

SN74S281FN3 by Texas Instruments is a TTL digital arithmetic circuit in a 28-terminal chip carrier package. Operating temperature range of 0-70°C, suitable for commercial applications. Surface mountable with J bend terminals, ideal for various electronic systems requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,130 parts In-Stock

1+ parts

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4,130

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Vyrian

USA . 3,497 parts In-Stock

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3,497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$18.601

100+ parts

-

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263

$18.601

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Parana Technologies

USA . 135 parts In-Stock

1+ parts

$30.202

100+ parts

-

1k+ parts

$68.193

10k+ parts

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135

$30.202

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$68.193

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DigiPath Technology Company

USA . 1,075 parts In-Stock

1+ parts

$33.256

100+ parts

$30.596

1k+ parts

-

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1,075

$33.256

$30.596

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ChromeModa Solutions

Germany . 5,473 parts In-Stock

1+ parts

$33.935

100+ parts

$27.827

1k+ parts

-

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5,473

$33.935

$27.827

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IDEA Electronic Components Group

UK . 2,288 parts In-Stock

1+ parts

$33.935

100+ parts

$32.238

1k+ parts

$30.542

10k+ parts

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2,288

$33.935

$32.238

$30.542

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One Stop Electronics

USA . 1,126 parts In-Stock

1+ parts

$34.000

100+ parts

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1,126

$34.000

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Corphita

USA . 478 parts In-Stock

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478

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Overview

Enhance your digital arithmetic circuits with the high-quality SN74S281FN3 by Texas Instruments. Crafted with precision and expertise, this chip carrier package offers outstanding performance and reliability in various applications. From commercial to industrial settings, this product provides value and benefits that customers can trust. Upgrade your electronic projects with Texas Instruments' cutting-edge technology and experience the advantages of seamless integration and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort.

Package Shape: SQUARE

The square shape of the package provides a compact design, optimizing space on the circuit board.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier style package offers enhanced thermal performance and improved electrical characteristics.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding applications without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cooler environments.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and better organization on the circuit board.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets standard temperature requirements for most applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, ideal for digital arithmetic circuits.

Terminal Form: J BEND

The J bend terminal form simplifies soldering and ensures secure connections on the circuit board.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact placement of terminals on the circuit board.

Technical Specifications

Digital Arithmetic Circuits SN74S281FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74S281FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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