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SN54HC682J-00

Texas Instruments

SN54HC682J-00 by Texas Instruments

SN54HC682J-00 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 413ns. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications requiring high-speed calculations and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,549 parts In-Stock

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3,549

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Digiode

USA . 796 parts In-Stock

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796

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Distributors (Availability)

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Andel Nordic

Denmark . 2,484 parts In-Stock

1+ parts

$6.738

100+ parts

-

1k+ parts

$6.468

10k+ parts

$6.468

2,484

$6.738

-

$6.468

$6.468

AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$10.698

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607

$10.698

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Parana Technologies

USA . 605 parts In-Stock

1+ parts

$16.016

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$16.359

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605

$16.016

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$16.359

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DigiPath Technology Company

USA . 2,028 parts In-Stock

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$17.635

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2,028

$17.635

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ChromeModa Solutions

Germany . 5,468 parts In-Stock

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$17.995

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$14.756

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5,468

$17.995

$14.756

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IDEA Electronic Components Group

UK . 2,350 parts In-Stock

1+ parts

$17.995

100+ parts

$17.095

1k+ parts

$16.196

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2,350

$17.995

$17.095

$16.196

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One Stop Electronics

USA . 580 parts In-Stock

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$23.000

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580

$23.000

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Corphita

USA . 2,906 parts In-Stock

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2,906

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Overview

Enhance your digital arithmetic circuits with the SN54HC682J-00 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that ensures optimal performance in a wide range of applications. Whether you're working on industrial automation or consumer electronics, this product offers unmatched value and benefits. Trust in Texas Instruments to provide you with the solutions you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides a durable and reliable package for the digital arithmetic circuit, ensuring long-term performance and protection against environmental factors.

Nominal Supply Voltage: 5V

Optimal supply voltage that ensures stable operation and performance of the digital arithmetic circuit.

Propagation Delay: 413 ns

Low propagation delay ensures fast operation and efficiency in processing arithmetic operations.

Temperature Grade: MILITARY

Suitable for use in military applications where reliability and durability are crucial, making this product a robust choice for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the digital arithmetic circuit energy-efficient and reliable in operation.

Technical Specifications

Digital Arithmetic Circuits SN54HC682J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULLUP RESISTORS ON B INPUTS

Family:

HC/UH

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

413 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54HC682J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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