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SN74HC881NTP3

Texas Instruments

SN74HC881NTP3 by Texas Instruments

Texas Instruments' SN74HC881NTP3 is a CMOS digital arithmetic circuit with 24 terminals in an in-line rectangular package. It operates b/w -40°C to 85°C, making it suitable for industrial applications requiring precise calculations and data processing. The through-hole terminal form and 2.54mm pitch enhance its reliability in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,710 parts In-Stock

1+ parts

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6,710

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Digiode

USA . 2,550 parts In-Stock

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2,550

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Distributors (Availability)

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AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$10.516

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433

$10.516

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Parana Technologies

USA . 1,455 parts In-Stock

1+ parts

$11.527

100+ parts

$1,070.483

1k+ parts

$10.375

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1,455

$11.527

$1,070.483

$10.375

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DigiPath Technology Company

USA . 712 parts In-Stock

1+ parts

$12.693

100+ parts

$11.678

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-

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712

$12.693

$11.678

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ChromeModa Solutions

Germany . 2,420 parts In-Stock

1+ parts

$12.952

100+ parts

$10.621

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2,420

$12.952

$10.621

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IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$12.952

100+ parts

$12.304

1k+ parts

$11.657

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310

$12.952

$12.304

$11.657

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One Stop Electronics

USA . 460 parts In-Stock

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$41.000

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460

$41.000

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Andel Nordic

Denmark . 2,404 parts In-Stock

1+ parts

$290.766

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$279.135

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$279.135

2,404

$290.766

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$279.135

$279.135

Corphita

USA . 768 parts In-Stock

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768

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC881NTP3 by Texas Instruments. This innovative product boasts high-quality construction and advanced technology, making it a reliable choice for industrial applications. With its durable plastic/epoxy package and dual terminal position, this component ensures optimal performance even in extreme temperatures ranging from -40 to 85°C. Trust Texas Instruments to deliver cutting-edge solutions that provide value, efficiency, and peace of mind for your projects. Upgrade to the SN74HC881NTP3 today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for industrial applications.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and allows for easy integration into various systems and setups.

No. of Terminals: 24

Having 24 terminals allows for a greater degree of connectivity and flexibility in circuit configurations.

Package Style (Meter): IN-LINE

In-line package style is easy to connect and install, making it user-friendly in different applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C ensures reliability in colder environments.

Terminal Position: DUAL

Dual terminal position allows for redundancy and increased reliability in connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product can perform reliably in harsh industrial conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong and reliable connections, ideal for industrial applications where vibrations may be present.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy and standardized connection to other components, enhancing compatibility.

Technical Specifications

Digital Arithmetic Circuits SN74HC881NTP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC881NTP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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