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MC14581BDW

Onsemi

MC14581BDW by Onsemi

MC14581BDW by Onsemi is a 4-bit digital arithmetic circuit with 1230 ns propagation delay. It operates b/w -55 to 125 °C and supports supply voltage range of 3-18 V. Ideal for military applications, this CMOS technology chip comes in a small outline package with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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< 1k

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Vyrian

USA . 452 parts In-Stock

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Digiode

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Kulean Microsystems

USA . 8,292 parts In-Stock

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SupplyDigital Components

Austria . 7,614 parts In-Stock

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Corphita

USA . 2,135 parts In-Stock

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Problanco Electronics

Mexico . 1,308 parts In-Stock

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TANS Electronics

Latvia . 1,079 parts In-Stock

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UHIMA Technologies

Türkiye . 289 parts In-Stock

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Corohmni

South Africa . 273 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the MC14581BDW by Onsemi, a top-quality manufacturer known for its reliable components. This versatile product offers a wide range of applications in various industries, providing countless benefits such as efficient performance and high durability. With a focus on value and innovation, this product ensures that customers receive top-notch quality and exceptional functionality, making it a must-have for any project requiring precision and reliability. Experience the advantage of Onsemi's expertise with the MC14581BDW today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY body material provides durability and reliability to the circuit, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Bits: 4

4 bits offer a moderate level of precision and control for arithmetic operations, making it suitable for a range of digital applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources in most electronic systems.

Propagation Delay (tpd): 1230 ns

Low propagation delay of 1230 ns ensures fast processing of arithmetic operations, enhancing overall performance of the circuit.

Minimum Operating Temperature: -55 °C

Wide operating temperature range of -55 to 125 °C allows for reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making it an efficient choice for digital circuits.

Technical Specifications

Digital Arithmetic Circuits MC14581BDW attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

1230 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC14581BDW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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