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MC14008BFEL

Onsemi

MC14008BFEL by Onsemi

MC14008BFEL by Onsemi is a CMOS digital arithmetic circuit with 16 terminals. It operates b/w -55 °C to 125°C, suitable for military-grade applications. With power supplies of 5/15V, it comes in a small outline package ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,275 parts In-Stock

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Vyrian

USA . 1,551 parts In-Stock

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1,551

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Kulean Microsystems

USA . 6,779 parts In-Stock

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6,779

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SupplyDigital Components

Austria . 6,553 parts In-Stock

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Problanco Electronics

Mexico . 2,050 parts In-Stock

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2,050

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TANS Electronics

Latvia . 1,255 parts In-Stock

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Corphita

USA . 1,230 parts In-Stock

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1,230

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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450

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Corohmni

South Africa . 130 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the MC14008BFEL by Onsemi. Crafted with precision and quality in mind, Onsemi's reputation for excellence shines through in this product. Ideal for a range of applications, this versatile device offers unmatched value and benefits to customers. Experience seamless integration and top-notch performance with the MC14008BFEL, setting a new standard in the industry. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the circuit, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

Package Shape: RECTANGULAR

Rectangular shape is a common and versatile design that fits well in various electronic setups.

Power Supplies (V): 5/15

Ability to operate at different voltage levels provides flexibility in powering the circuit according to the requirements.

No. of Terminals: 16

Sufficient terminals allow for connection to other components or devices for seamless integration.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space and enables efficient use of circuit board real estate.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in a wide range of environments, including extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish on terminals provides good solderability and conductivity for secure connections.

Terminal Position: DUAL

Dual-terminal position offers flexibility in orientation during installation, allowing for customized setups.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures high reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the circuit energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, enhancing the durability and reliability of connections.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for secure connections and efficient layout on circuit boards.

Technical Specifications

Digital Arithmetic Circuits MC14008BFEL attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MC14008BFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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