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SN74LS181J

Texas Instruments

SN74LS181J by Texas Instruments

SN74LS181J by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 62 ns. Operating at a supply voltage of 5V, it has 24 terminals and a load capacitance of 15 pF. This TTL technology chip is commonly used in commercial applications requiring fast arithmetic calculations.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,658 parts In-Stock

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Vyrian

USA . 1,251 parts In-Stock

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Semi Source

USA . 67 parts In-Stock

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ECAB

Sweden . 59 parts In-Stock

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AZTECH Wire

Italy . 674 parts In-Stock

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$14.409

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674

$14.409

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Parana Technologies

USA . 1,744 parts In-Stock

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$15.745

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$16.107

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1,744

$15.745

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ChromeModa Solutions

Germany . 2,481 parts In-Stock

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$17.691

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$14.507

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$17.691

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IDEA Electronic Components Group

UK . 1,191 parts In-Stock

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$17.691

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$16.806

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$15.922

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Semicontronic

India . 561 parts In-Stock

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$33.000

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$32.175

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$32.010

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561

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One Stop Electronics

USA . 704 parts In-Stock

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$52.000

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Corphita

USA . 1,567 parts In-Stock

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$15.950

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$15.950

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the SN74LS181J by Texas Instruments. Built with top-quality ceramic and glass-sealed materials, this product offers reliable performance with a nominal supply voltage of 5V. Perfect for a wide range of applications, this 4-bit circuit provides quick propagation delays and operates efficiently in commercial temperature grades. Trust Texas Instruments to deliver cutting-edge technology that meets your needs. Experience the value and benefits of the SN74LS181J for yourself!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making this product suitable for long-term use in various conditions.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can handle a moderate level of data processing, making it versatile for various applications without being overly complex.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this circuit into existing systems.

Propagation Delay (tpd): 62 ns

The relatively low propagation delay of 62 ns allows for fast data processing, ensuring efficient performance in time-sensitive applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function reliably in a wide range of environments without risk of overheating.

Technical Specifications

Digital Arithmetic Circuits SN74LS181J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

LS

JESD-30 Code:

R-GDIP-T24

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

37 mA

Propagation Delay (tpd):

62 ns

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS181J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-068-2635, 5962010682635

NIIN

010682635

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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