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SNM54LS631JD

Texas Instruments

SNM54LS631JD by Texas Instruments

SNM54LS631JD by Texas Instruments is a MIL-STD-883 Class C rated digital arithmetic circuit with 28 terminals. Operating temperature ranges from -55°C to 125°C, suitable for military applications. Utilizes TTL technology in a ceramic package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,621 parts In-Stock

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2,621

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Digiode

USA . 2,602 parts In-Stock

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2,602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,680 parts In-Stock

1+ parts

$3.923

100+ parts

-

1k+ parts

$3.766

10k+ parts

$3.766

3,680

$3.923

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$3.766

$3.766

AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$6.989

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418

$6.989

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Parana Technologies

USA . 2,293 parts In-Stock

1+ parts

$11.359

100+ parts

$1,054.862

1k+ parts

$10.223

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2,293

$11.359

$1,054.862

$10.223

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DigiPath Technology Company

USA . 2,251 parts In-Stock

1+ parts

$12.508

100+ parts

$11.507

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2,251

$12.508

$11.507

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ChromeModa Solutions

Germany . 3,995 parts In-Stock

1+ parts

$12.763

100+ parts

$10.466

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3,995

$12.763

$10.466

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IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$12.763

100+ parts

$12.125

1k+ parts

$11.487

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1,111

$12.763

$12.125

$11.487

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One Stop Electronics

USA . 1,228 parts In-Stock

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$34.000

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1,228

$34.000

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Corphita

USA . 4,942 parts In-Stock

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4,942

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Overview

Texas Instruments sets the standard for excellence with the SNM54LS631JD digital arithmetic circuit. Designed with precision and reliability in mind, this military-grade component is ideal for a wide range of applications. From aerospace to industrial automation, this product offers unbeatable value, performance, and durability. Trust Texas Instruments for cutting-edge technology that delivers results you can count on. Upgrade your systems with the SNM54LS631JD and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material helps in better heat dissipation, making the product more reliable and durable.

Screening Level: MIL-STD-883 Class C

Compliance with MIL-STD-883 Class C ensures high quality and reliability of the product, suitable for military and aerospace applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration and efficient use of space in electronic circuit designs.

No. of Terminals: 28

Sufficient number of terminals allow for complex circuit connections and functionality.

Package Style (Meter): IN-LINE

In-line package style offers easy mounting and handling during assembly and maintenance processes.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to function reliably in extreme cold conditions without performance degradation.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in circuit connectivity, ensuring reliable operation.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high durability and performance under extreme environmental conditions.

Technology: TTL

TTL technology offers low power consumption and high speed operation, making the product suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy and secure soldering, ensuring reliable connections in electronic circuits.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with existing electronic designs and compatibility with common PCB layouts.

Technical Specifications

Digital Arithmetic Circuits SNM54LS631JD attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNM54LS631JD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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