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SN74185ANP1

Texas Instruments

SN74185ANP1 by Texas Instruments

SN74185ANP1 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals and a supply voltage of 5V. It operates in commercial temperature grades from 0 to 70°C, making it suitable for various applications requiring precise calculations in electronics. The package style is in-line rectangular made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,971 parts In-Stock

1+ parts

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4,971

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Vyrian

USA . 2,608 parts In-Stock

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2,608

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$9.747

100+ parts

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760

$9.747

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Parana Technologies

USA . 1,262 parts In-Stock

1+ parts

$11.574

100+ parts

-

1k+ parts

$11.982

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1,262

$11.574

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$11.982

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DigiPath Technology Company

USA . 1,811 parts In-Stock

1+ parts

$12.745

100+ parts

$11.725

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1,811

$12.745

$11.725

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ChromeModa Solutions

Germany . 5,639 parts In-Stock

1+ parts

$13.005

100+ parts

$10.664

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5,639

$13.005

$10.664

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

1+ parts

$13.005

100+ parts

$12.355

1k+ parts

$11.704

10k+ parts

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1,483

$13.005

$12.355

$11.704

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One Stop Electronics

USA . 395 parts In-Stock

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$40.000

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395

$40.000

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Corphita

USA . 831 parts In-Stock

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831

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Overview

Looking for high-quality digital arithmetic circuits? Look no further than the SN74185ANP1 by Texas Instruments. Known for their reliability and precision, Texas Instruments delivers top-notch products that stand out in the industry. This versatile component is perfect for a wide range of applications, offering customers unparalleled value and performance. Upgrade your electronic projects with the SN74185ANP1 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement within electronic circuits or PCBs.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic devices, increasing compatibility with existing systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and stability in various environmental conditions.

Technology: TTL

The use of Transistor-Transistor Logic technology provides fast switching speeds and compatibility with other TTL devices.

Technical Specifications

Digital Arithmetic Circuits SN74185ANP1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74185ANP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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