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TPM4582AJ

Texas Instruments

TPM4582AJ by Texas Instruments

TPM4582AJ by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an IN-LINE package. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. Its ceramic body and rectangular shape ensure durability and ease of integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,966 parts In-Stock

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8,966

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Digiode

USA . 2,013 parts In-Stock

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2,013

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One Stop Electronics

USA . 1,374 parts In-Stock

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$5.000

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1,374

$5.000

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Parana Technologies

USA . 1,367 parts In-Stock

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$7.235

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$7.738

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$7.235

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$7.738

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Andel Nordic

Denmark . 444 parts In-Stock

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$7.953

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$7.635

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$7.635

444

$7.953

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$7.635

$7.635

DigiPath Technology Company

USA . 1,187 parts In-Stock

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$7.966

100+ parts

$7.329

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1,187

$7.966

$7.329

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ChromeModa Solutions

Germany . 552 parts In-Stock

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$8.129

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$6.666

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552

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$6.666

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IDEA Electronic Components Group

UK . 118 parts In-Stock

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$8.129

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$7.316

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118

$8.129

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$7.316

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AZTECH Wire

Italy . 774 parts In-Stock

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$13.742

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Corphita

USA . 851 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPM4582AJ digital arithmetic circuit. Designed for industrial-grade applications, this versatile component offers unmatched performance and efficiency in a compact, rectangular package. Whether you're working on automation systems, control panels, or data processing equipment, the TPM4582AJ is the ideal solution to meet your needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your projects with unparalleled value and benefits. Choose the TPM4582AJ for seamless integration and exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, which helps in dissipating heat efficiently and maintaining stable operation even at high temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration and placement on circuit boards, optimizing space usage and ensuring compatibility with standard board layouts.

No. of Terminals: 16

Having 16 terminals offers flexibility in connectivity options, allowing for multiple input and output connections to other components within a circuit.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process, making it convenient to mount and connect the circuit without any intricate positioning requirements.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand relatively high temperatures, ensuring reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for a wide range of environments, including those with cold conditions.

Terminal Position: DUAL

Dual terminal positions offer increased versatility in circuit connectivity, enabling various configurations and setups to meet specific design requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product is built to withstand harsh operating conditions and maintain performance consistency in demanding environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, contributing to energy efficiency and reliable operation in digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide durable and secure connections with the circuit board, offering stability and reliability during operation, especially in rugged industrial environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection with standard spacing, facilitating efficient assembly and compatibility with common circuit board designs.

Technical Specifications

Digital Arithmetic Circuits TPM4582AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TPM4582AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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