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SN54H183W-10

Texas Instruments

SN54H183W-10 by Texas Instruments

SN54H183W-10 by Texas Instruments is a digital arithmetic circuit with 2 functions, operating at 5V. It has a propagation delay of 18ns and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring fast calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,246 parts In-Stock

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8,246

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Digiode

USA . 4,475 parts In-Stock

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4,475

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Distributors (Availability)

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Andel Nordic

Denmark . 4,751 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

$8.054

10k+ parts

$8.054

4,751

$8.390

-

$8.054

$8.054

AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$10.416

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882

$10.416

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Parana Technologies

USA . 784 parts In-Stock

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$15.148

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$15.551

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784

$15.148

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$15.551

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ChromeModa Solutions

Germany . 6,336 parts In-Stock

1+ parts

$17.020

100+ parts

$13.956

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6,336

$17.020

$13.956

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IDEA Electronic Components Group

UK . 953 parts In-Stock

1+ parts

$17.020

100+ parts

$16.169

1k+ parts

$15.318

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953

$17.020

$16.169

$15.318

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One Stop Electronics

USA . 227 parts In-Stock

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$55.000

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227

$55.000

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Corphita

USA . 1,785 parts In-Stock

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DigiPath Technology Company

USA . 147 parts In-Stock

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$15.345

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147

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$15.345

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Overview

Enhance your digital arithmetic circuits with the SN54H183W-10 by Texas Instruments. Known for their high-quality products, TI delivers top-notch performance and reliability. This versatile component boasts a wide range of applications in various industries, providing customers with unmatched value and benefits. From its ceramic, glass-sealed body to its dual terminal position and military-grade temperature grade, the SN54H183W-10 offers exceptional features that meet the demands of any project. Trust Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package provides durability and protection for the circuit against environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product into compact electronic devices, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes it compatible with a wide range of electronic systems and power sources.

Propagation Delay (tpd): 18 ns

Low propagation delay ensures quick processing and response time, making this product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain reliable performance under extreme heat.

Technology: TTL

Using TTL (Transistor-Transistor Logic) technology provides reliable and high-speed performance for digital logic circuits, making this product ideal for various applications.

Technical Specifications

Digital Arithmetic Circuits SN54H183W-10 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

69 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SN54H183W-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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