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SNJ54F350FK

Texas Instruments

SNJ54F350FK by Texas Instruments

SNJ54F350FK by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates b/w -55 to 125°C, suitable for military applications. With a supply voltage range of 4.5V to 5.5V, it features 3-STATE output characteristics and comes in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,898 parts In-Stock

1+ parts

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2,898

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Digiode

USA . 2,279 parts In-Stock

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2,279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$18.107

100+ parts

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700

$18.107

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Parana Technologies

USA . 591 parts In-Stock

1+ parts

$18.750

100+ parts

-

1k+ parts

$18.840

10k+ parts

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591

$18.750

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$18.840

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DigiPath Technology Company

USA . 878 parts In-Stock

1+ parts

$20.646

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-

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878

$20.646

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ChromeModa Solutions

Germany . 1,703 parts In-Stock

1+ parts

$21.067

100+ parts

$17.275

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1,703

$21.067

$17.275

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$21.067

100+ parts

$20.014

1k+ parts

$18.960

10k+ parts

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537

$21.067

$20.014

$18.960

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One Stop Electronics

USA . 417 parts In-Stock

1+ parts

$45.000

100+ parts

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417

$45.000

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Corphita

USA . 3,034 parts In-Stock

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3,034

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Overview

Unlock the power of precision with the SNJ54F350FK by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this digital arithmetic circuit offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile chip carrier is designed to deliver seamless operation and high efficiency. Elevate your projects with the excellence you can trust from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides durability and reliability, making it suitable for harsh operating environments.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuit boards, saving space and facilitating automated assembly processes.

Screening Level: 38535Q/M;38534H;883B

The high screening levels ensure that the product meets stringent quality and reliability standards, making it ideal for mission-critical applications.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can handle a wide range of computational tasks efficiently and effectively.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to incorporate into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the circuit to withstand elevated temperatures without compromising performance, enhancing its reliability.

Technology: TTL

The TTL technology offers high-speed operation and low power consumption, making it suitable for applications where speed and efficiency are crucial.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the circuit can operate reliably in extreme temperature conditions, making it suitable for military and aerospace applications.

Technical Specifications

Digital Arithmetic Circuits SNJ54F350FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH BARREL SHIFTING

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54F350FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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