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SN5482J

Texas Instruments

SN5482J by Texas Instruments

SN5482J by Texas Instruments is a 2-bit digital arithmetic circuit with a propagation delay of 42ns. Operating at a supply voltage of 5V, it has a load capacitance of 15pF and is designed for military-grade applications requiring TTL technology in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,848 parts In-Stock

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Digiode

USA . 124 parts In-Stock

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Electronic Expediters

USA . 118 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 23 parts In-Stock

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ECAB

Sweden . 18 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Andel Nordic

Denmark . 2,811 parts In-Stock

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$2.307

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$2.215

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$2.215

2,811

$2.307

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$2.215

$2.215

Parana Technologies

USA . 980 parts In-Stock

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$17.813

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$17.994

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980

$17.813

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$17.994

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AZTECH Wire

Italy . 314 parts In-Stock

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$17.954

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DigiPath Technology Company

USA . 2,257 parts In-Stock

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$19.615

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$19.615

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IDEA Electronic Components Group

UK . 2,166 parts In-Stock

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$20.015

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$19.014

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$18.014

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ChromeModa Solutions

Germany . 2,044 parts In-Stock

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$20.015

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$16.412

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Aztec Data Supply Inc.

USA . 450 parts In-Stock

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$32.510

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$32.510

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One Stop Electronics

USA . 507 parts In-Stock

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$59.000

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Corphita

USA . 4,595 parts In-Stock

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Kepictronics

USA . 157 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SN5482J by Texas Instruments. Crafted with precision and expertise, this digital arithmetic circuit boasts unparalleled quality and reliability. Ideal for a wide range of applications, this product offers exceptional value and benefits to customers looking for high-performance solutions. Experience seamless operation and superior efficiency with the SN5482J, setting new standards in the industry. Elevate your projects with Texas Instruments and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the circuits, making the product reliable and long-lasting.

No. of Bits: 2

Suitable for basic arithmetic operations and simple calculations, making it cost-effective for certain applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement ensures compatibility with common power sources, convenient for integration into various systems.

Propagation Delay (tpd): 42 ns

Low propagation delay allows for fast processing of data, improving overall efficiency of the circuit.

Technology: TTL

TTL technology offers high speed and low power consumption, making it suitable for applications requiring quick operations and energy efficiency.

Technical Specifications

Digital Arithmetic Circuits SN5482J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; PERMITS RIPPLE CARRY CASCADING

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN5482J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-004-6355, 5962000046355, 5962-00-506-6346, 5962005066346, 5962-00-689-1635, 5962006891635

NIIN

000046355, 005066346, 006891635

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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