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SN74HC882JT

Texas Instruments

SN74HC882JT by Texas Instruments

SN74HC882JT by Texas Instruments is a CMOS digital arithmetic circuit with 24 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, making it suitable for industrial applications. The ceramic package body and rectangular shape ensure durability and ease of integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,637 parts In-Stock

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6,637

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Digiode

USA . 2,766 parts In-Stock

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2,766

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Distributors (Availability)

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Andel Nordic

Denmark . 3,896 parts In-Stock

1+ parts

$2.275

100+ parts

-

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$2.184

10k+ parts

$2.184

3,896

$2.275

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$2.184

$2.184

Parana Technologies

USA . 1,967 parts In-Stock

1+ parts

$9.025

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$9.691

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1,967

$9.025

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$9.691

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DigiPath Technology Company

USA . 2,109 parts In-Stock

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$9.937

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2,109

$9.937

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ChromeModa Solutions

Germany . 4,962 parts In-Stock

1+ parts

$10.140

100+ parts

$8.315

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4,962

$10.140

$8.315

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IDEA Electronic Components Group

UK . 1,575 parts In-Stock

1+ parts

$10.140

100+ parts

$9.633

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$9.126

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1,575

$10.140

$9.633

$9.126

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AZTECH Wire

Italy . 550 parts In-Stock

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$13.207

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550

$13.207

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One Stop Electronics

USA . 1,332 parts In-Stock

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$52.000

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1,332

$52.000

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Corphita

USA . 4,877 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC882JT by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications for this product category. The SN74HC882JT provides unmatched value, benefits, and advantages to customers looking for efficient solutions in industrial-grade environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and stability, making them ideal for high temperature applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount and integrate into existing circuitry.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh operating conditions reliably.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the product can perform in both extreme cold and hot environments.

Terminal Position: DUAL

Dual terminal positions offer redundancy and improved reliability in connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can be used in demanding industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections for increased durability and ease of soldering.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for easy connection to other components and compatibility with common circuit layouts.

Technical Specifications

Digital Arithmetic Circuits SN74HC882JT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC882JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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