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SNC54AS881AFH

Texas Instruments

SNC54AS881AFH by Texas Instruments

SNC54AS881AFH by Texas Instruments is a TTL digital arithmetic circuit in a ceramic chip carrier package. Operating temperature range from -55°C to 125°C, MIL-STD-883 Class B screening level for military applications. Features 28 terminals with surface mount capability suitable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,615 parts In-Stock

1+ parts

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2,615

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Digiode

USA . 2,568 parts In-Stock

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2,568

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 166 parts In-Stock

1+ parts

$6.073

100+ parts

-

1k+ parts

$5.830

10k+ parts

$5.830

166

$6.073

-

$5.830

$5.830

Parana Technologies

USA . 69 parts In-Stock

1+ parts

$13.917

100+ parts

-

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$14.400

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69

$13.917

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$14.400

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AZTECH Wire

Italy . 873 parts In-Stock

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$14.523

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873

$14.523

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DigiPath Technology Company

USA . 298 parts In-Stock

1+ parts

$15.324

100+ parts

$14.098

1k+ parts

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298

$15.324

$14.098

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ChromeModa Solutions

Germany . 2,161 parts In-Stock

1+ parts

$15.637

100+ parts

$12.822

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2,161

$15.637

$12.822

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$15.637

100+ parts

$14.855

1k+ parts

$14.073

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1,390

$15.637

$14.855

$14.073

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One Stop Electronics

USA . 407 parts In-Stock

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$29.000

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407

$29.000

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Corphita

USA . 2,632 parts In-Stock

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2,632

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Overview

Elevate your digital arithmetic circuits with the SNC54AS881AFH by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in every product they manufacture. Designed to meet MILITARY standards, this chip carrier offers unparalleled performance in a compact square package. From military applications to industrial automation, this innovative solution provides customers with high-quality results and exceptional value. Upgrade your circuit design with the SNC54AS881AFH and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide good thermal conductivity, which helps in dissipating heat efficiently and ensuring reliable performance over a wide temperature range.

Surface Mount: YES

Surface mount technology enables easy installation on printed circuit boards, saving space and facilitating automated manufacturing processes.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting MIL-STD-883 Class B standards ensures high reliability and quality, making this product suitable for critical applications in challenging environments.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and better alignment during assembly.

No. of Terminals: 28

Having 28 terminals provides flexibility in connecting the circuit to other components and peripherals, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging offers high component density and good protection against mechanical stress, enhancing the durability of the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the circuit to function reliably in harsh conditions without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the circuit can operate in extreme cold environments without any issues.

Terminal Position: QUAD

Quad terminal position arrangement facilitates easy soldering and connection, improving the efficiency of the installation process.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure the circuit can withstand rugged conditions and operate consistently in demanding military applications.

Technology: TTL

TTL (Transistor-Transistor Logic) technology offers fast switching speeds and low power consumption, making the circuit ideal for high-speed digital applications.

Terminal Form: NO LEAD

The absence of lead terminals makes the product environmentally friendly and compliant with RoHS regulations.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch ensures precise and reliable connections, reducing the risk of electrical short circuits and signal distortion.

Technical Specifications

Digital Arithmetic Circuits SNC54AS881AFH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54AS881AFH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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