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SNJ54LS382AW

Texas Instruments

SNJ54LS382AW by Texas Instruments

SNJ54LS382AW by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 39ns. It operates within a temperature range of -55 to 125°C, making it suitable for military-grade applications. This TTL technology chip has a supply voltage range of 4.5V to 5.5V and comes in a rectangular flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,689 parts In-Stock

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4,689

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Digiode

USA . 2,638 parts In-Stock

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2,638

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 189 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

$1.680

10k+ parts

$1.680

189

$1.750

-

$1.680

$1.680

AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$8.094

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615

$8.094

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Parana Technologies

USA . 2,155 parts In-Stock

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$28.244

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$45.317

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2,155

$28.244

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$45.317

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DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$31.100

100+ parts

$28.612

1k+ parts

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117

$31.100

$28.612

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ChromeModa Solutions

Germany . 3,872 parts In-Stock

1+ parts

$31.735

100+ parts

$26.023

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3,872

$31.735

$26.023

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

1+ parts

$31.735

100+ parts

$30.148

1k+ parts

$28.562

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1,972

$31.735

$30.148

$28.562

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One Stop Electronics

USA . 482 parts In-Stock

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$37.000

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482

$37.000

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Corphita

USA . 2,621 parts In-Stock

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Overview

Discover the unmatched precision and reliability of the SNJ54LS382AW by Texas Instruments, a leading name in digital arithmetic circuits. This versatile component, crafted from high-quality ceramic and metal-sealed cofired materials, is designed for seamless integration into a wide range of applications. With a 4-bit design and lightning-fast 39 ns propagation delay, this product offers unparalleled performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets the demands of even the most rigorous military-grade environments. Elevate your projects with the exceptional value and benefits of the SNJ54LS382AW today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability for long-term use

No. of Bits: 4

Offers a good balance between precision and complexity for arithmetic operations

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, making integration easier

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for various operating environments

Temperature Grade: MILITARY

Meets stringent military grade standards for reliability and performance

Technical Specifications

Digital Arithmetic Circuits SNJ54LS382AW attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS

Family:

LS

JESD-30 Code:

R-CDFP-F20

Length:

13.09 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

39 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.92 mm

Trade Compliance

SNJ54LS382AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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