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SN74S280D3

Texas Instruments

SN74S280D3 by Texas Instruments

SN74S280D3 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals, operating at 5V. It comes in a small outline package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise arithmetic calculations in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,835 parts In-Stock

1+ parts

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8,835

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Digiode

USA . 3,089 parts In-Stock

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3,089

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 757 parts In-Stock

1+ parts

$6.856

100+ parts

-

1k+ parts

$6.582

10k+ parts

$6.582

757

$6.856

-

$6.582

$6.582

Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$13.009

100+ parts

-

1k+ parts

$13.503

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-

1,505

$13.009

-

$13.503

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DigiPath Technology Company

USA . 795 parts In-Stock

1+ parts

$14.325

100+ parts

$13.179

1k+ parts

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10k+ parts

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795

$14.325

$13.179

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ChromeModa Solutions

Germany . 6,954 parts In-Stock

1+ parts

$14.617

100+ parts

$11.986

1k+ parts

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10k+ parts

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6,954

$14.617

$11.986

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IDEA Electronic Components Group

UK . 911 parts In-Stock

1+ parts

$14.617

100+ parts

$13.886

1k+ parts

$13.155

10k+ parts

-

911

$14.617

$13.886

$13.155

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$16.568

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672

$16.568

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One Stop Electronics

USA . 704 parts In-Stock

1+ parts

$55.000

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704

$55.000

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Corphita

USA . 3,121 parts In-Stock

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3,121

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Overview

Looking for a reliable digital arithmetic circuit for your electronic projects? Look no further than the SN74S280D3 by Texas Instruments. Known for their high-quality components, Texas Instruments delivers exceptional performance and reliability in every product. The SN74S280D3 is perfect for applications requiring precise arithmetic calculations, making it ideal for a wide range of electronic devices. With its small outline package and commercial temperature grade, this circuit offers convenience and durability. Trust Texas Instruments to provide you with the value and benefits you need for your next project. Elevate your designs with the SN74S280D3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, maximizing space utilization on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems and components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments without compromising performance.

Technology: TTL

TTL technology offers high speed and reliability, making the product suitable for demanding digital arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits SN74S280D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74S280D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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