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SN74ALS526J

Texas Instruments

SN74ALS526J by Texas Instruments

SN74ALS526J by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, suitable for commercial applications requiring dual terminal positions. With a terminal pitch of 2.54mm, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,807 parts In-Stock

1+ parts

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2,807

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Digiode

USA . 1,446 parts In-Stock

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1,446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,255 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,255

$5.000

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Andel Nordic

Denmark . 5,458 parts In-Stock

1+ parts

$6.009

100+ parts

-

1k+ parts

$5.769

10k+ parts

$5.769

5,458

$6.009

-

$5.769

$5.769

AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$15.952

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247

$15.952

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Parana Technologies

USA . 581 parts In-Stock

1+ parts

$17.013

100+ parts

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1k+ parts

$17.238

10k+ parts

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581

$17.013

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$17.238

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DigiPath Technology Company

USA . 1,620 parts In-Stock

1+ parts

$18.734

100+ parts

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1,620

$18.734

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ChromeModa Solutions

Germany . 4,513 parts In-Stock

1+ parts

$19.116

100+ parts

$15.675

1k+ parts

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4,513

$19.116

$15.675

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IDEA Electronic Components Group

UK . 760 parts In-Stock

1+ parts

$19.116

100+ parts

$18.160

1k+ parts

$17.204

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760

$19.116

$18.160

$17.204

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Corphita

USA . 2,343 parts In-Stock

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2,343

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74ALS526J digital arithmetic circuit. Designed for optimal performance, this product offers precision and efficiency in a variety of applications. From industrial automation to consumer electronics, the SN74ALS526J delivers unmatched value and benefits to customers seeking top-notch solutions. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and high heat resistance, making it ideal for electronic components that require stable performance at high temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on a circuit board, maximizing space utilization and facilitating easy assembly.

No. of Terminals: 20

Having 20 terminals provides flexibility for connecting multiple inputs and outputs, making the circuit versatile and capable of handling complex arithmetic operations.

Package Style (Meter): IN-LINE

The in-line package style simplifies integration into existing electronic systems and allows for easy connection with other components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this circuit can perform reliably under normal operating conditions without risk of overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the circuit can function even in colder environments, providing consistent performance in a variety of conditions.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection to external components, enhancing the overall reliability and longevity of the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the circuit is suitable for use in standard commercial applications where temperature fluctuations are within normal limits.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the circuit efficient for arithmetic operations while maintaining high accuracy.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and reliable connections, ensuring stability and durability in the circuit's design.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and assembly, making the circuit user-friendly and suitable for integration into various electronic systems.

Technical Specifications

Digital Arithmetic Circuits SN74ALS526J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS526J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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