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TP4531AN

Texas Instruments

TP4531AN by Texas Instruments

TP4531AN by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an industrial-grade rectangular package. It operates b/w -40°C to 85°C, making it suitable for various industrial applications requiring precise calculations and data processing. The through-hole terminal form and 2.54mm pitch enhance its reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,925 parts In-Stock

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2,925

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Digiode

USA . 828 parts In-Stock

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828

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ECAB

Sweden . 24 parts In-Stock

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24

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GES GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 385 parts In-Stock

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$9.786

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385

$9.786

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Parana Technologies

USA . 1,115 parts In-Stock

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$20.297

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$20.305

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$20.297

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$20.305

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$22.350

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1,034

$22.350

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ChromeModa Solutions

Germany . 5,713 parts In-Stock

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$22.806

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$18.701

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5,713

$22.806

$18.701

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IDEA Electronic Components Group

UK . 761 parts In-Stock

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$22.806

100+ parts

$21.666

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$20.525

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761

$22.806

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$20.525

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One Stop Electronics

USA . 1,046 parts In-Stock

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$25.000

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1,046

$25.000

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Corphita

USA . 2,199 parts In-Stock

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2,199

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Unlock the power of precision with the TP4531AN by Texas Instruments. Crafted with superior quality and expertise, this digital arithmetic circuit delivers unparalleled performance in a variety of industrial applications. Engineered with cutting-edge CMOS technology, this product guarantees reliability and efficiency. Whether you're designing automation systems or control units, the TP4531AN will provide unmatched value, benefits, and advantages to elevate your projects to the next level. Choose Texas Instruments for excellence in every circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and provides a compact form factor.

No. of Terminals: 16

With 16 terminals, this product offers versatility in connecting to other components in the circuit.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and connectivity within a circuit layout.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments where elevated temperatures may be present.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and multiple connection options for enhanced reliability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can withstand harsh environmental conditions in industrial settings.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an efficient choice for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections on a circuit board.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with standard spacing on circuit boards, allowing for easy integration.

Technical Specifications

Digital Arithmetic Circuits TP4531AN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TP4531AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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