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TP4582AN

Texas Instruments

TP4582AN by Texas Instruments

TP4582AN by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an industrial-grade rectangular package. Operating temperature ranges from -40 to 85 °C, making it suitable for various industrial applications requiring precise calculations and data processing. The through-hole terminal form and 2.54 mm pitch ensure reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,825 parts In-Stock

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Vyrian

USA . 2,276 parts In-Stock

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ECAB

Sweden . 50 parts In-Stock

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50

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Component Electronics Inc.

Canada . 20 parts In-Stock

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20

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Andel Nordic

Denmark . 766 parts In-Stock

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$7.145

100+ parts

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$6.859

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$6.859

766

$7.145

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$6.859

$6.859

AZTECH Wire

Italy . 478 parts In-Stock

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$9.261

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478

$9.261

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Parana Technologies

USA . 2,067 parts In-Stock

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$9.729

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$10.310

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2,067

$9.729

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$10.310

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DigiPath Technology Company

USA . 80 parts In-Stock

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$10.712

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$9.855

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80

$10.712

$9.855

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ChromeModa Solutions

Germany . 5,628 parts In-Stock

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$10.931

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$8.963

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$8.963

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IDEA Electronic Components Group

UK . 1,177 parts In-Stock

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$10.931

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$10.384

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$9.838

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1,177

$10.931

$10.384

$9.838

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One Stop Electronics

USA . 255 parts In-Stock

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$35.000

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Corphita

USA . 3,307 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Discover the cutting-edge TP4582AN by Texas Instruments, a top-of-the-line digital arithmetic circuit designed for industrial applications. With Texas Instruments' renowned reputation for quality and innovation, this product offers unmatched reliability and performance. From its durable plastic/epoxy package to its 16 terminals and CMOS technology, the TP4582AN is built to excel in challenging environments. Experience the value and benefits of this advanced circuit in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and non-conductive, making it ideal for protecting the sensitive components of the digital arithmetic circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy stacking and placement of multiple circuits, making the product space-efficient and convenient for installations.

No. of Terminals: 16

Having 16 terminals provides enough connectivity options for various input and output signals, allowing for versatile usage in different applications.

Package Style (Meter): IN-LINE

In-line package style simplifies the wiring and connections of the circuits, making it easy to integrate into existing systems or designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the circuits can withstand high heat environments without any performance issues, ensuring reliability in challenging conditions.

Minimum Operating Temperature: -40 °C

The circuits can operate efficiently even in extremely cold temperatures as low as -40°C, making them suitable for a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connections, reducing the risk of signal loss or disruptions during operation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the circuits can perform reliably in harsh industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and low noise characteristics, making the circuits efficient, fast, and reliable for digital arithmetic operations.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong mechanical connection, making it easier to solder and assemble the circuits onto PCBs or other components securely.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, the circuits can easily be integrated into existing designs or breadboard setups, allowing for quick and convenient prototyping.

Technical Specifications

Digital Arithmetic Circuits TP4582AN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TP4582AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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