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TPC4582AJ

Texas Instruments

TPC4582AJ by Texas Instruments

TPC4582AJ by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a ceramic rectangular package style. Ideal for applications requiring precise arithmetic calculations in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,067 parts In-Stock

1+ parts

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3,067

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Digiode

USA . 2,509 parts In-Stock

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2,509

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$6.705

100+ parts

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558

$6.705

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Andel Nordic

Denmark . 987 parts In-Stock

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$7.917

100+ parts

-

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$7.600

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$7.600

987

$7.917

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$7.600

$7.600

Parana Technologies

USA . 634 parts In-Stock

1+ parts

$15.851

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$16.209

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634

$15.851

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$16.209

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DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

$17.454

100+ parts

$16.057

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127

$17.454

$16.057

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ChromeModa Solutions

Germany . 6,576 parts In-Stock

1+ parts

$17.810

100+ parts

$14.604

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6,576

$17.810

$14.604

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IDEA Electronic Components Group

UK . 3 parts In-Stock

1+ parts

$17.810

100+ parts

$16.920

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$16.029

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3

$17.810

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$16.029

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One Stop Electronics

USA . 1,484 parts In-Stock

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$34.000

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1,484

$34.000

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Corphita

USA . 2,022 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TPC4582AJ by Texas Instruments. Crafted with precision and quality, this digital arithmetic circuit offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures seamless operation and efficiency. Experience the value and benefits of Texas Instruments' innovative solutions with the TPC4582AJ, providing customers with the advantage they need to stay ahead in the competitive market. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and reliability, making it suitable for industrial applications where temperature fluctuation is common.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and compact placement within electronic systems, saving space and enabling efficient circuit board layout.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various input and output signals, making this product versatile in its applications.

Package Style (Meter): IN-LINE

In-line package style simplifies the connection process and ensures a clean and organized setup, aiding in troubleshooting and maintenance tasks.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that this product can operate effectively in extreme cold conditions, expanding its usability in various climates.

Terminal Position: DUAL

Dual terminal position allows for easy connection and secure mounting, enhancing the stability and durability of the product during operation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees the reliability and stability of the product in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and minimal interference in the circuit, resulting in reliable performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections on PCBs, ensuring stability and ease of assembly, making it a preferred choice for many electronic designs.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for compatibility with various standard connectors and sockets, facilitating easy integration into existing electronic systems.

Technical Specifications

Digital Arithmetic Circuits TPC4582AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TPC4582AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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