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SN74ALS679DWP3

Texas Instruments

SN74ALS679DWP3 by Texas Instruments

SN74ALS679DWP3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in a small outline package. It operates b/w 0°C to 70°C, suitable for commercial applications. The surface-mount rectangular package is made of plastic/epoxy, featuring dual gull-wing terminals at 1.27mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,187 parts In-Stock

1+ parts

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5,187

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Digiode

USA . 2,357 parts In-Stock

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2,357

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,154 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

$6.384

10k+ parts

$6.384

4,154

$6.650

-

$6.384

$6.384

AZTECH Wire

Italy . 465 parts In-Stock

1+ parts

$12.994

100+ parts

-

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465

$12.994

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One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$17.000

100+ parts

-

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471

$17.000

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Parana Technologies

USA . 2,079 parts In-Stock

1+ parts

$17.189

100+ parts

-

1k+ parts

$17.407

10k+ parts

-

2,079

$17.189

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$17.407

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ChromeModa Solutions

Germany . 6,422 parts In-Stock

1+ parts

$19.313

100+ parts

$15.837

1k+ parts

-

10k+ parts

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6,422

$19.313

$15.837

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

1+ parts

$19.313

100+ parts

$18.347

1k+ parts

$17.382

10k+ parts

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1,798

$19.313

$18.347

$17.382

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Corphita

USA . 4,186 parts In-Stock

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4,186

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DigiPath Technology Company

USA . 644 parts In-Stock

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$17.413

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644

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$17.413

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Overview

Unlock the power of digital arithmetic with the SN74ALS679DWP3 by Texas Instruments. Known for their top-quality products, Texas Instruments has designed this versatile circuit to offer unmatched performance in a variety of applications. Whether you're working on industrial automation or consumer electronics, this small outline package provides exceptional value and reliability. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SN74ALS679DWP3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat, making this product reliable for long-term use in various environments.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit designs, making this product suitable for applications where space is limited.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and integration into circuit layouts, ensuring seamless installation and operation.

No. of Terminals: 20

Having multiple terminals allows for a wider range of connections and functionalities, making this product versatile for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient and compatible with modern electronic devices, making this product ideal for compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate heat levels, ensuring stable performance in various operating conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in cold environments without compromising its functionality.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit connections and allows for efficient signal routing, enhancing the overall performance of the product.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets industry standards for performance and reliability, making it a trusted choice for various electronic projects.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of digital systems and devices, making this product versatile for integration into different applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure connections, ensuring reliable performance and durability in demanding operating conditions.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers precise and compact terminal spacing for efficient circuit layouts, enabling high-density designs with optimal performance.

Technical Specifications

Digital Arithmetic Circuits SN74ALS679DWP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS679DWP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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