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78027012A

Texas Instruments

78027012A by Texas Instruments

The Texas Instruments 78027012A is an 8-bit digital arithmetic circuit with a propagation delay of 19 ns at 5V. It features a MIL-STD-883 screening level, operates in a temperature range of -55 to 125 °C, and has a max power supply current of 10 mA. Ideal for military applications requiring fast processing and low power consumption.

Median Price

$27.010

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

$27.010

100+ parts

$26.470

1k+ parts

$25.930

10k+ parts

-

19

$27.010

$26.470

$25.930

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 988 parts In-Stock

1+ parts

$32.775

100+ parts

-

1k+ parts

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10k+ parts

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988

$32.775

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Vyrian

USA . 4,723 parts In-Stock

1+ parts

-

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4,723

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DigiKey Marketplace

USA . 19 parts In-Stock

1+ parts

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 56 parts In-Stock

1+ parts

$14.990

100+ parts

-

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56

$14.990

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Northwest PG Solutions

USA . 1,543 parts In-Stock

1+ parts

$16.489

100+ parts

$14.840

1k+ parts

-

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1,543

$16.489

$14.840

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Parana Technologies

USA . 563 parts In-Stock

1+ parts

$26.276

100+ parts

-

1k+ parts

$26.868

10k+ parts

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563

$26.276

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$26.868

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

$28.934

100+ parts

$26.619

1k+ parts

-

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1,114

$28.934

$26.619

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ChromeModa Solutions

Germany . 3,655 parts In-Stock

1+ parts

$29.524

100+ parts

$24.210

1k+ parts

-

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3,655

$29.524

$24.210

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$29.524

100+ parts

$28.048

1k+ parts

$26.572

10k+ parts

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1,524

$29.524

$28.048

$26.572

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Corphita

USA . 450 parts In-Stock

1+ parts

$31.050

100+ parts

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450

$31.050

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Microchip USA

USA . 1,036 parts In-Stock

1+ parts

$78.890

100+ parts

$77.520

1k+ parts

$76.830

10k+ parts

$76.150

1,036

$78.890

$77.520

$76.830

$76.150

Overview

Elevate your digital arithmetic circuits with the Texas Instruments 78027012A. Manufactured with precision and quality materials, this chip carrier package offers unmatched performance in a wide range of applications. With a military-grade screening level and fast propagation delay, this product is designed to meet the demands of even the most rigorous tasks. Say goodbye to inefficiencies and hello to seamless operations with the 78027012A by Texas Instruments. Experience the value and benefits that this cutting-edge technology brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high durability and resistance to extreme temperatures, making the product reliable in harsh conditions.

Propagation Delay At Nominal Supply: 19 ns

Fast propagation delay ensures quick processing of arithmetic operations, making the product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Screening Level: MIL-STD-883

Compliance with military screening standards ensures high quality and reliability in demanding environments.

No. of Bits: 8

8 bits allow for a wide range of digital calculations, offering versatility in arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and compatibility with standard electronic systems.

Load Capacitance (CL): 15 pF

Low load capacitance helps in reducing power consumption and enhancing the efficiency of the circuit.

Power Supplies (V): 5

Matching power supplies at 5V ensure proper functionality and prevent damage from voltage fluctuations.

Maximum I (ol): 4 Amp

High output current rating of 4A enables the product to drive external components effectively.

Output Polarity: INVERTED

Inverted output polarity offers flexibility in connecting to other components, enhancing compatibility in various circuit configurations.

Technical Specifications

Digital Arithmetic Circuits 78027012A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

19 ns

Propagation Delay (tpd):

36 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuit

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

78027012A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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