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MC10165P

Onsemi

MC10165P by Onsemi

MC10165P by Onsemi is an 8-bit digital arithmetic circuit with a propagation delay of 4ns. It operates b/w -30 to 85 °C and has a terminal pitch of 2.54mm. Widely used in applications requiring fast arithmetic calculations in electronic systems.

Median Price

$0.951

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 175 parts In-Stock

1+ parts

-

100+ parts

$0.951

1k+ parts

$0.790

10k+ parts

$0.704

175

-

$0.951

$0.790

$0.704

Distributors (In-Stock)

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Digiode

USA . 260 parts In-Stock

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$0.741

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260

$0.741

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Vyrian

USA . 5,862 parts In-Stock

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5,862

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A2Z Electronics, Inc.

USA . 971 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 155 parts In-Stock

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155

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Classic Components Corporation

USA . 144 parts In-Stock

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144

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Electronic Expediters

USA . 88 parts In-Stock

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Resion

USA . 31 parts In-Stock

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LWI Electronics Inc

India . 24 parts In-Stock

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Prism Electronics

USA . 18 parts In-Stock

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Q Components

USA . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 256 parts In-Stock

1+ parts

$0.702

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256

$0.702

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Corohmni

South Africa . 292 parts In-Stock

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$0.780

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292

$0.780

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Problanco Electronics

Mexico . 8,177 parts In-Stock

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TANS Electronics

Latvia . 7,082 parts In-Stock

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SupplyDigital Components

Austria . 4,600 parts In-Stock

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Microchip USA

USA . 1,534 parts In-Stock

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UHIMA Technologies

Türkiye . 414 parts In-Stock

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Kepictronics

USA . 257 parts In-Stock

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Kulean Microsystems

USA . 199 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Perfect Parts

USA . 20 parts In-Stock

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Overview

Discover the cutting-edge MC10165P by Onsemi, a top-tier manufacturer known for delivering high-quality digital arithmetic circuits. With a sleek rectangular package body made of durable plastic/epoxy, this 8-bit wonder boasts a lightning-fast propagation delay of just 4 ns. Ideal for various applications, from signal processing to data communications, the MC10165P offers customers unparalleled value and performance. Say goodbye to slow calculations and hello to efficiency with this innovative product that promises to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is easy to handle and has long-lasting performance.

No. of Bits: 8

Having 8 bits allows for a wide range of possible calculations and operations, making the product versatile in handling digital arithmetic tasks.

Propagation Delay (tpd): 4 ns

With a low propagation delay of 4 ns, this product can process data quickly and efficiently, making it suitable for high-speed digital arithmetic applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can withstand heat and operate reliably in various environments.

Technology: ECL

The use of ECL (Emitter-Coupled Logic) technology in this product provides high-speed performance and low power consumption, making it an efficient choice for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits MC10165P attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10165P Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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